Inventor · disambiguated record
Paul C. Waldrop
Also filed as: WALDROP PAUL · WALDROP PAUL C
10 granted patents·1 pending application·103 citations·filing 1999–2024
90Inventor score
Top patents by PatentIndex Score
11 records- 0183US6544863B1Method of fabricating semiconductor wafers having multiple height subsurface layersCALIENT NETWORKS INC·Filed 2001·Granted Apr 8, 2003·35 cites·13 claims
- 0276US6702950B2Method for fabricating LC device using latent masking and delayed LOCOS techniquesFiled 2001·Granted Mar 9, 2004·7 cites·9 claims
- 0376US6673253B2Method of fabricating integrated LC/ESI device using smile, latent masking, and delayed locos techniques.KIONIX INC·Filed 2001·Granted Jan 6, 2004·7 cites·9 claims
- 0476US6464892B2Methods of fabricating microelectromechanical and microfluidic devicesFiled 2001·Granted Oct 15, 2002·21 cites·19 claims
- 0574US6913701B2Method for fabricating integrated LC/ESI device using SMILE, latent masking, and delayed LOCOS techniquesKIONIX INC·Filed 2003·Granted Jul 5, 2005·6 cites·9 claims
- 0665US6706200B2Method for fabricating ESI device using smile and delayed LOCOS techniquesKIONIX INC·Filed 2001·Granted Mar 16, 2004·8 cites·9 claims
- 0763US6444138B1Method of fabricating microelectromechanical and microfluidic devicesFiled 1999·Granted Sep 3, 2002·16 cites·4 claims
- 0859US2024375942A1Double notch etch to reduce under cut of micro electro-mechanical system (mems) devicesCALIENT TECH INC·Filed 2024·Application pending·0 cites
- 0953US6780336B2Methods of fabricating MEMS and microfluidic devices using latent masking techniqueFiled 2001·Granted Aug 24, 2004·3 cites·3 claims
- 1045US6824697B2Method for fabricating mems and microfluidic devices using smile, latent masking, and delayed locos techniquesKIONIX INC·Filed 2001·Granted Nov 30, 2004·0 cites·6 claims
- 1134US6969470B2Method for fabricating ESI device using smile and delayed LOCOS techniquesKIONIX INC·Filed 2003·Granted Nov 29, 2005·0 cites·7 claims
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