Inventor · disambiguated record
Yi-Hsiu Liu
Also filed as: LIU YI · LIU YI-HSIU
16 granted patents·14 pending applications·24 citations·filing 2010–2025
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD20SKYWORKS SOLUTIONS INC6ADVANCED MICRO DEVICES CO LTD SHANGHAI1ADVANCED MICRO DEVICES SHANGHAI CO LTD1HSIEH YU-LING1
Top patents by PatentIndex Score
30 records- 0197US11508831B2Gate spacer structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·4 cites·20 claims
- 0296US11984489B2Air spacer for a gate structure of a transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 14, 2024·2 cites·20 claims
- 0395US11888049B2Dielectric isolation structure for multi-gate transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 30, 2024·2 cites·20 claims
- 0494US10868142B2Gate spacer structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·7 cites·20 claims
- 0593US12113113B2Semiconductor device with a core-shell feature and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 8, 2024·2 cites·20 claims
- 0684US11694933B2Methods of forming metal gate spacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 4, 2023·3 cites·20 claims
- 0784US2025311265A1Dielectric isolation structure for multi-gate transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0883US12349381B2Dielectric isolation structure for multi-gate transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 0983US12062709B2Gate spacer structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 1080US11705505B2Gate spacer structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 18, 2023·0 cites·20 claims
- 1179US2024347616A1Air spacer for a gate structure of a transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1277US9214438B2Die-die stacking structure and method for making the sameADVANCED MICRO DEVICES SHANGHAI CO LTD·Filed 2015·Granted Dec 15, 2015·3 cites·13 claims
- 1376US2025331268A1Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1475US2025056851A1Semiconductor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1574US11532733B1Dielectric isolation structure for multi-gate transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 1673US2023402338A1Electronic package with through-mold connections and related electronic assemblySKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 1773US2023402293A1Methods for manufacturing electronic packages and electronic assembliesSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 1873US2024371959A1Semiconductor device with a core-shell feature and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1973US2023402294A1Methods for mounting an electronic package to a circuit boardSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 2070US2022352037A1Methods Of Forming Metal Gate SpacerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2167US12389652B2Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 2266US12166076B2Semiconductor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
- 2364US11508827B2Air spacer for a gate structure of a transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 22, 2022·0 cites·20 claims
- 2461US2024363509A1Molded package with interconnect posts with plated solder capsSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 2558US12376339B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 2656US2024087999A1Packaging substrate having metal postsSKYWORKS SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 2755US8994191B2Die-die stacking structure and method for making the sameADVANCED MICRO DEVICES CO LTD SHANGHAI·Filed 2014·Granted Mar 31, 2015·1 cites·39 claims
- 2852US2025349682A1Dual-sided mold grid array module having flat bottomSKYWORKS SOLUTIONS INC·Filed 2025·Application pending·0 cites
- 2937US2011278054A1Circuit board with notched conductor padsLEE I-TSENG·Filed 2010·Application pending·0 cites
- 3030US2011299259A1Circuit board with conductor post structureHSIEH YU-LING·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →