Inventor

NIKLAUS FRANK

SE9 patents

⚠️ This page may combine multiple inventors who share the name “NIKLAUS FRANK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FISCHER ANDREAS

2 patents

US9054162B2Jun 9, 2015

Method and an apparatus for forming electrically conductive vias in a substrate, an automated robot-based manufacturing system, a component comprising a substrate with via holes, and an interposer device

FISCHER ANDREAS3 citations61

US9027239B2May 12, 2015

Method for plugging a hole

FISCHER ANDREAS0 citations46

NIKLAUS FRANK

1 patent

US7054052B2May 30, 2006

Adhesive sacrificial bonding of spatial light modulators

NIKLAUS FRANK12 citations78

KAELVESTEN EDVARD

1 patent

US7067345B2Jun 27, 2006

Method of joining components

KAELVESTEN EDVARD4 citations60

BRAUN STEFAN

1 patent

US9054224B2Jun 9, 2015

Method for the wafer-level integration of shape memory alloy wires

BRAUN STEFAN2 citations54

ZEDNA AB

1 patent

US11442026B2Sep 13, 2022

Crack structure and tunneling device with a layer exhibiting a crack-defined gap between two cantilevering parts

ZEDNA AB0 citations51

DUBOIS VALENTIN

1 patent

US10782249B2Sep 22, 2020

Crack structures, tunneling junctions using crack structures and methods of making same

DUBOIS VALENTIN1 citations51

QUELLMALZ ARNE

1 patent

US11504959B2Nov 22, 2022

Method of material transfer

QUELLMALZ ARNE1 citations49

RIBET FEDERICO

1 patent

US12515947B2Jan 6, 2026

Method and arrangement for assembly of microchips into a separate substrate

RIBET FEDERICO0 citations34