Inventor · disambiguated record
Toshiharu Wada
Also filed as: WADA TOSHIHARU
14 granted patents·3 pending applications·38 citations·filing 1999–2025
87Inventor score
Top patents by PatentIndex Score
17 records- 0186US10128085B2Method of plasma etchingTOKYO ELECTRON LTD·Filed 2016·Granted Nov 13, 2018·5 cites·8 claims
- 0272US10950442B2Methods to reshape spacers for multi-patterning processes using thermal decomposition materialsTOKYO ELECTRON LTD·Filed 2019·Granted Mar 16, 2021·1 cites·17 claims
- 0371US10978300B2Methods to reduce gouging for core removal processes using thermal decomposition materialsTOKYO ELECTRON LTD·Filed 2019·Granted Apr 13, 2021·1 cites·19 claims
- 0471US6913115B2Fluid pressure-operated apparatus-connecting deviceSMC KK·Filed 2002·Granted Jul 5, 2005·19 cites·15 claims
- 0570US10861739B2Method of patterning low-k materials using thermal decomposition materialsTOKYO ELECTRON LTD·Filed 2019·Granted Dec 8, 2020·1 cites·20 claims
- 0667US9847231B2Method of etchingTOKYO ELECTRON LTD·Filed 2016·Granted Dec 19, 2017·1 cites·7 claims
- 0767US9583317B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2016·Granted Feb 28, 2017·1 cites·5 claims
- 0856US2025357082A1Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0949US2024087846A1Plasma processing apparatus and rf systemTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1047US10916428B2Method to transfer patterns to a layerTOKYO ELECTRON LTD·Filed 2019·Granted Feb 9, 2021·0 cites·19 claims
- 1146US11557479B2Methods for EUV inverse patterning in processing of microelectronic workpiecesTOKYO ELECTRON LTD·Filed 2020·Granted Jan 17, 2023·0 cites·19 claims
- 1246US11276572B2Technique for multi-patterning substratesTOKYO ELECTRON LTD·Filed 2018·Granted Mar 15, 2022·0 cites·19 claims
- 1344US11049721B2Method and process for forming memory hole patternsTOKYO ELECTRON LTD·Filed 2019·Granted Jun 29, 2021·0 cites·20 claims
- 1443US7007713B2Pressure control apparatusSMC CORP·Filed 2003·Granted Mar 7, 2006·2 cites·6 claims
- 1543US2019393084A1Method Utilizing Thermal Decomposition Material To Relax Queue Time ControlTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 1642US11537049B2Method of line roughness improvement by plasma selective depositionTOKYO ELECTRON LTD·Filed 2019·Granted Dec 27, 2022·0 cites·22 claims
- 1735US6145627AZero point position-determining mechanism for pressurized fluid-driven apparatusesSMC KK·Filed 1999·Granted Nov 14, 2000·7 cites·6 claims
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