Inventor
SINGHAL AKHIL
US24 patents
⚠️ This page may combine multiple inventors who share the name “SINGHAL AKHIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
16 patentsUS9773643B1Sep 26, 2017
Apparatus and method for deposition and etch in gap fill
LAM RES CORP41 citations96
US10373806B2Aug 6, 2019
Apparatus and method for deposition and etch in gap fill
LAM RES CORP17 citations93
US10157736B2Dec 18, 2018
Methods of encapsulation
LAM RES CORP13 citations91
US10566186B2Feb 18, 2020
Methods of encapsulation
LAM RES CORP9 citations83
US9328416B2May 3, 2016
Method for the reduction of defectivity in vapor deposited films
LAM RES CORP17 citations82
US11670516B2Jun 6, 2023
Metal-containing passivation for high aspect ratio etch
LAM RES CORP3 citations72
US10957514B2Mar 23, 2021
Apparatus and method for deposition and etch in gap fill
LAM RES CORP4 citations72
US10840082B2Nov 17, 2020
Method to clean SnO2 film from chamber
LAM RES CORP3 citations71
US10763107B2Sep 1, 2020
Methods of encapsulation
LAM RES CORP3 citations71
US11887846B2Jan 30, 2024
Deposition tool and method for depositing metal oxide films on organic materials
LAM RES CORP0 citations62
US11915923B2Feb 27, 2024
Method to clean SnO2 film from chamber
LAM RES CORP0 citations61
US11031244B2Jun 8, 2021
Modification of SNO2 surface for EUV lithography
LAM RES CORP0 citations61
US12372872B2Jul 29, 2025
Extreme ultraviolet (EUV) lithography using an intervening layer or a multi-layer stack with varying mean free paths for secondary electron generation
LAM RES CORP0 citations59
US12532675B2Jan 20, 2026
Core removal
LAM RES CORP0 citations55
US12371781B2Jul 29, 2025
In situ protective coating of chamber components for semiconductor processing
LAM RES CORP0 citations52
US9617637B2Apr 11, 2017
Systems and methods for improving deposition rate uniformity and reducing defects in substrate processing systems
LAM RES CORP0 citations29
APPLIED MATERIALS INC
5 patentsUS12381106B2Aug 5, 2025
Systems and methods of seasoning electrostatic chucks with dielectric seasoning films
APPLIED MATERIALS INC0 citations61
US12315724B2May 27, 2025
Helium-free silicon formation
APPLIED MATERIALS INC0 citations61
US12211908B2Jan 28, 2025
Profile shaping for control gate recesses
APPLIED MATERIALS INC0 citations61
US11784229B2Oct 10, 2023
Profile shaping for control gate recesses
APPLIED MATERIALS INC1 citations61
US11646216B2May 9, 2023
Systems and methods of seasoning electrostatic chucks with dielectric seasoning films
APPLIED MATERIALS INC1 citations61
NOVELLUS SYSTEMS INC
3 patentsUS7214630B1May 8, 2007
PMOS transistor with compressive dielectric capping layer
NOVELLUS SYSTEMS INC511 citations99
US7998881B1Aug 16, 2011
Method for making high stress boron-doped carbon films
NOVELLUS SYSTEMS INC11 citations84
US7327001B1Feb 5, 2008
PMOS transistor with compressive dielectric capping layer
NOVELLUS SYSTEMS INC16 citations84