P

Inventor

CHEN TONG-YU

TW41 patents
⚠️ This page may combine multiple inventors who share the name “CHEN TONG-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

28 patents
US6184142B1Feb 6, 2001

Process for low k organic dielectric film etch

UNITED MICROELECTRONICS CORP81 citations96
US6426298B1Jul 30, 2002

Method of patterning a dual damascene

UNITED MICROELECTRONICS CORP52 citations93
US6083845AJul 4, 2000

Etching method

UNITED MICROELECTRONICS CORP20 citations93
US6559004B1May 6, 2003

Method for forming three dimensional semiconductor structure and three dimensional capacitor

UNITED MICROELECTRONICS CORP51 citations92
US6221772B1Apr 24, 2001

Method of cleaning the polymer from within holes on a semiconductor wafer

UNITED MICROELECTRONICS CORP34 citations92
US6010968AJan 4, 2000

Method for forming a contact opening with multilevel etching

UNITED MICROELECTRONICS CORP21 citations92
US6352938B2Mar 5, 2002

Method of removing photoresist and reducing native oxide in dual damascene copper process

UNITED MICROELECTRONICS CORP25 citations90
US9048285B2Jun 2, 2015

Semiconductor structure and method of forming a harmonic-effect-suppression structure

UNITED MICROELECTRONICS CORP6 citations84
US6528428B1Mar 4, 2003

Method of forming dual damascene structure

UNITED MICROELECTRONICS CORP13 citations84
US6218084B1Apr 17, 2001

Method for removing photoresist layer

UNITED MICROELECTRONICS CORP17 citations84
US6147007ANov 14, 2000

Method for forming a contact hole on a semiconductor wafer

UNITED MICROELECTRONICS CORP11 citations74
US9871123B2Jan 16, 2018

Field effect transistor and manufacturing method thereof

UNITED MICROELECTRONICS CORP2 citations73
US6972259B2Dec 6, 2005

Method for forming openings in low dielectric constant material layer

UNITED MICROELECTRONICS CORP9 citations73
US6180532B1Jan 30, 2001

Method for forming a borderless contact hole

UNITED MICROELECTRONICS CORP8 citations73
US6139702AOct 31, 2000

Seasoning process for etcher

UNITED MICROELECTRONICS CORP13 citations73
US10847412B2Nov 24, 2020

Interconnect structure, interconnect layout structure, and manufacturing method thereof

UNITED MICROELECTRONICS CORP2 citations71
US10658232B2May 19, 2020

Interconnect structure

UNITED MICROELECTRONICS CORP2 citations71
US6361929B1Mar 26, 2002

Method of removing a photo-resist layer on a semiconductor wafer

UNITED MICROELECTRONICS CORP7 citations68
US7319074B2Jan 15, 2008

Method of defining polysilicon patterns

UNITED MICROELECTRONICS CORP6 citations63
US6316311B1Nov 13, 2001

Method of forming borderless contact

UNITED MICROELECTRONICS CORP4 citations62
US6307174B1Oct 23, 2001

Method for high-density plasma etching

UNITED MICROELECTRONICS CORP5 citations62
US6184147B1Feb 6, 2001

Method for forming a high aspect ratio borderless contact hole

UNITED MICROELECTRONICS CORP5 citations62
US5994233ANov 30, 1999

Oxide etching method

UNITED MICROELECTRONICS CORP4 citations62
US6306757B1Oct 23, 2001

Method for forming a multilevel interconnect

UNITED MICROELECTRONICS CORP4 citations58
US9378998B2Jun 28, 2016

Semiconductor structure and method of forming a harmonic-effect-suppression structure

UNITED MICROELECTRONICS CORP0 citations52
US9214384B2Dec 15, 2015

Method of forming trench in semiconductor substrate

UNITED MICROELECTRONICS CORP0 citations52
US10276429B2Apr 30, 2019

Interconnect structure, interconnect layout structure, and manufacturing method thereof

UNITED MICROELECTRONICS CORP0 citations50
US10134449B2Nov 20, 2018

Semiconductor memory device

UNITED MICROELECTRONICS CORP0 citations41

WANG CHIH-JUNG

5 patents

CHEN TONG-YU

4 patents

INFINEON TECHNOLOGIES AG

1 patent

APPLIED MATERIALS INC

1 patent

UNITED MICROLECTRONICS CORP

1 patent

IBM

1 patent