Inventor
Lin yi-nong
TW15 patents
Patents
15 patentsUS9439290B1Sep 6, 2016
Carrier board structure
KINSUS INTERCONNECT TECH CORP7 citations83
US9847165B2Dec 19, 2017
Winged coil structure and method of manufacturing the same
KINSUS INTERCONNECT TECH CORP2 citations72
US11495390B2Nov 8, 2022
Buildup board structure
KINSUS INTERCONNECT TECH CORP0 citations61
US10440837B2Oct 8, 2019
Manufacturing method of double layer circuit board
KINSUS INTERCONNECT TECH CORP1 citations61
US10779405B2Sep 15, 2020
Landless multilayer circuit board and manufacturing method thereof
KINSUS INTERCONNECT TECH CORP0 citations51
US10779418B2Sep 15, 2020
Manufacturing method of double layer circuit board
KINSUS INTERCONNECT TECH CORP0 citations51
US10440836B2Oct 8, 2019
Double layer circuit board
KINSUS INTERCONNECT TECH CORP0 citations51
US10405423B2Sep 3, 2019
Multi-layer circuit board
KINSUS INTERCONNECT TECH CORP0 citations51
US10366822B2Jul 30, 2019
Method of manufacturing winged coil structure
KINSUS INTERCONNECT TECH CORP0 citations51
US10256030B2Apr 9, 2019
Flexible plate adapted to be used in winged coil structure, winged coil structure, and method of manufacturing winged coil structure
KINSUS INTERCONNECT TECH CORP0 citations51
US10256028B2Apr 9, 2019
Buildup board structure
KINSUS INTERCONNECT TECH CORP0 citations51
US10039185B2Jul 31, 2018
Manufacturing method of landless multilayer circuit board
KINSUS INTERCONNECT TECH CORP1 citations51
US9967975B2May 8, 2018
Multi-layer circuit board
KINSUS INTERCONNECT TECH CORP0 citations51
US10371719B2Aug 6, 2019
Printed circuit board circuit test fixture with adjustable density of test probes mounted thereon
KINSUS INTERCONNECT TECH CORP0 citations40
US9570227B1Feb 14, 2017
Magnetic excitation coil structure
KINSUS INTERCONNECT TECH CORP0 citations40