Inventor

SHIN WON SUN

KR18 patents

⚠️ This page may combine multiple inventors who share the name “SHIN WON SUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIN WON SUN

AMKOR TECHNOLOGY INC

Semiconductor package and method for fabricating the same

Semiconductor package and method for fabricating the same

Semiconductor package and method for fabricating the same

Thin semiconductor package including stacked dies

Circuit board for semiconductor package

Semiconductor package and method for fabricating the same

Semiconductor package and method for fabricating the same

Semiconductor package and method for fabricating the same

ANAM SEMICONDUCTOR INC

Lead end grid array semiconductor package

Grid array type lead frame having lead ends in different planes

Semiconductor package including heat sink with layered conductive plate and non-conductive tape bonding to leads

ST ASSEMBLY TEST SERVICES LTD

System for different bond pads in an integrated circuit package

Method of manufacturing different bond pads on the same substrate of an integrated circuit package

System for fabricating an integrated circuit package on a printed circuit board

AMKOR ELECTRONICS INC

Semiconductor lead frame having connection bar and guide rings

STATS CHIPPAC LTD

Torch bump

ANAM IND CO LTD

Method for fabricating a heat sink-integrated semiconductor package

ST ASSEMBLY TEST SERVICES PTE

Method of forming a small pitch torch bump for mounting high-performance flip-flop devices