Inventor
SHIRAKI SATOSHI
JP29 patents
⚠️ This page may combine multiple inventors who share the name “SHIRAKI SATOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
14 patentsUS6279585B1Aug 28, 2001
Etching method and method for manufacturing semiconductor device using the same
DENSO CORP40 citations92
US6274452B1Aug 14, 2001
Semiconductor device having multilayer interconnection structure and method for manufacturing the same
DENSO CORP52 citations92
US6242792B1Jun 5, 2001
Semiconductor device having oblique portion as reflection
DENSO CORP31 citations92
US6465839B2Oct 15, 2002
Semiconductor device having lateral MOSFET (LDMOS)
DENSO CORP15 citations84
US6768183B2Jul 27, 2004
Semiconductor device having bipolar transistors
DENSO CORP8 citations73
US6809034B2Oct 26, 2004
Method of etching metallic thin film on thin film resistor
DENSO CORP9 citations72
US7821069B2Oct 26, 2010
Semiconductor device and method for manufacturing the same
DENSO CORP4 citations63
US7799667B2Sep 21, 2010
Method for manufacturing semiconductor device with planer gate electrode and trench gate electrode
DENSO CORP4 citations63
US7755187B2Jul 13, 2010
Load driving device
DENSO CORP2 citations63
US7639060B2Dec 29, 2009
Level shift circuit
DENSO CORP2 citations63
US7109558B2Sep 19, 2006
Power MOS transistor having capability for setting substrate potential independently of source potential
DENSO CORP6 citations63
US7223668B2May 29, 2007
Method of etching metallic thin film on thin film resistor
DENSO CORP3 citations60
US7829971B2Nov 9, 2010
Semiconductor apparatus
DENSO CORP1 citations52
US9214536B2Dec 15, 2015
Lateral insulated gate bipolar transistor
DENSO CORP0 citations42
SHINKO ELECTRIC IND CO
7 patentsUS9036362B2May 19, 2015
Electronic component incorporated substrate
SHINKO ELECTRIC IND CO11 citations84
US9935053B2Apr 3, 2018
Electronic component integrated substrate
SHINKO ELECTRIC IND CO2 citations73
US9524931B2Dec 20, 2016
Wiring substrate, semiconductor package, and method for manufacturing semiconductor package
SHINKO ELECTRIC IND CO4 citations73
US8987919B2Mar 24, 2015
Built-in electronic component substrate and method for manufacturing the substrate
SHINKO ELECTRIC IND CO2 citations63
US12009333B2Jun 11, 2024
Semiconductor device
SHINKO ELECTRIC IND CO0 citations62
US11239196B2Feb 1, 2022
Semiconductor device
SHINKO ELECTRIC IND CO0 citations62
US9941232B2Apr 10, 2018
Electronic component device
SHINKO ELECTRIC IND CO0 citations41