Inventor

BOYD W ERIC

US20 patents

⚠️ This page may combine multiple inventors who share the name “BOYD W ERIC”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BOYD W ERIC

IRVINE SENSORS CORP

Method for precision integrated circuit die singulation using differential etch rates

Imaging device with multiple fields of view incorporating memory-based temperature compensation of an uncooled focal plane array

APROLASE DEV CO LLC

Field programmable gate array utilizing dedicated memory stacks in a vertical layer format

Stackable layer containing ball grid array package

BINDRUP RANDY

Anti-tamper wrapper interconnect method and a device

Wire bond through-via structure and method

GANN KEITH

Ball grid array package format layers and structure

Stackable layer containing ball grid array package

LIEU PETER

Method for depackaging prepackaged integrated circuit die and a product from the method

Method for fabricating a neo-layer using stud bumped bare die

OZGUZ VOLKAN H

Field programmable gate array utilizing dedicated memory stacks in a vertical layer format

HSU YING

Portable lip reading sensor system

OZGUZ VOLKAN

Stackable semiconductor chip layer comprising prefabricated trench interconnect vias

SAPIR ITZHAK

Energy harvesting buoy

LUDWIG DAVID

Method for precision integrated circuit die singulation using differential etch rates

PFG IP LLC

Wire bond through-via structure and method

JUSTICE JAMES

Self-calibrating targeting sight

HE SAMBO

Cap chip and reroute layer for stacked microelectronic module

YAMAGUCHI JAMES

Method for defining an electrically conductive metal structure on a three-dimensional element and a device made from the method

GANN KEITH D

Stacked microelectronic layer and module with three-axis channel T-connects