Inventor
YENRUDEE SUEBPHONG
TH16 patents
⚠️ This page may combine multiple inventors who share the name “YENRUDEE SUEBPHONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UTAC HEADQUARTERS PTE LTD
13 patentsUS9922843B1Mar 20, 2018
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
UTAC HEADQUARTERS PTE LTD3 citations83
US9805955B1Oct 31, 2017
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
UTAC HEADQUARTERS PTE LTD5 citations83
US10242953B1Mar 26, 2019
Semiconductor package with plated metal shielding and a method thereof
UTAC HEADQUARTERS PTE LTD7 citations77
US10163658B2Dec 25, 2018
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
UTAC HEADQUARTERS PTE LTD1 citations62
US10734247B2Aug 4, 2020
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
UTAC HEADQUARTERS PTE LTD0 citations51
US10325782B2Jun 18, 2019
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
UTAC HEADQUARTERS PTE LTD0 citations51
US10269686B1Apr 23, 2019
Method of improving adhesion between molding compounds and an apparatus thereof
UTAC HEADQUARTERS PTE LTD0 citations51
US10096490B2Oct 9, 2018
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
UTAC HEADQUARTERS PTE LTD0 citations51
US10032645B1Jul 24, 2018
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
UTAC HEADQUARTERS PTE LTD0 citations51
US9917038B1Mar 13, 2018
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
UTAC HEADQUARTERS PTE LTD0 citations51
US10361146B2Jul 23, 2019
Semiconductor package with multiple stacked leadframes and a method of manufacturing the same
UTAC HEADQUARTERS PTE LTD0 citations49
US10276477B1Apr 30, 2019
Semiconductor package with multiple stacked leadframes and a method of manufacturing the same
UTAC HEADQUARTERS PTE LTD0 citations49
US10600741B1Mar 24, 2020
Semiconductor package with plated metal shielding and a method thereof
UTAC HEADQUARTERS PTE LTD0 citations45