Inventor

HSIAO CHENG-HSU

TW58 patents

⚠️ This page may combine multiple inventors who share the name “HSIAO CHENG-HSU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSIAO CHENG-HSU

SILICONWARE PRECISION INDUSTRIES CO LTD

Method of making semiconductor package with heat spreader

Wafer level semiconductor package with build-up layer and method for fabricating the same

Bump structure of semiconductor package and method for fabricating the same

Stacked semiconductor structure and fabrication method thereof

Method for fabricating thermally enhanced semiconductor package

Thermally enhanced semiconductor package

Fabricating method for semiconductor package

Semiconductor package substrate

Semiconductor package with photosensitive chip and fabrication method thereof

Semiconductor package with heat spreader

Semiconductor package with heat sink

Semiconductor package with heat sink attached to substrate

Semiconductor package with heat sink

Semiconductor package with stacked chips

Stack structure of semiconductor packages and method for fabricating the stack structure

Semiconductor package and fabrication method thereof

IC card type circuit module

IC card type circuit module

Digital memory card

Chip scale package structure with metal pads exposed from an encapsulant

Heat dissipating package structure and method for fabricating the same

Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof

Semiconductor package having heat dissipating device with cooling fluid

Heat dissipating package structure and method for fabricating the same

Semiconductor package and fabrication method thereof

Method for fabricating wafer level semiconductor package with build-up layer

Semiconductor package with heat sink

Method for fabricating semiconductor package having conductive bumps on chip

Fabrication method of semiconductor package with heat sink

Fabrication method of semiconductor package with photosensitive chip

Semiconductor package and substrate structure thereof

Semiconductor device package with a heat sink and method for fabricating the same

Heat dissipation semiconductor package

Fabrication method of semiconductor package having heat dissipation device

Method of making semiconductor package with heat spreader

Semiconductor package with heat sink

Digital memory card

Semiconductor package for memory chips

Fabrication method of semiconductor package

Semiconductor package and method for fabricating the same

Semiconductor package with stacked chips

Heat-dissipating semiconductor package structure and method for manufacturing the same

Semiconductor package fabrication method

Method for fabricating semiconductor packages

Fabrication method of semiconductor package

HUANG CHIEN-PING

Method of fabricating stacked semiconductor structure

Method for fabricating heat dissipating package structure

SILICONWARE PRECICION IND CO L

Semiconductor package having conductive bumps on chip and method for fabricating the same

PU HAN-PING

Method for fabricating chip scale package structure with metal pads exposed from an encapsulant

HUANG WEN-HOME

Semiconductor package and fabrication method thereof