Heat-dissipating semiconductor package structure and method for manufacturing the same

Abstract

A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.

1. A heat-dissipating semiconductor package structure, comprising:
 a chip carrier; 
 at least a first semiconductor chip disposed on and electrically connected to the chip carrier; 
 at least a semiconductor package disposed on and electrically connected to the chip carrier, wherein the semiconductor package has been mounted with at least a second semiconductor chip and packaged; 
 a heat-dissipating element having a flat portion disposed on the top surface of the semiconductor package, wherein the area of the flat portion is bigger than that of the top surface of the semiconductor package for covering the semiconductor package; and 
 an encapsulant formed on the chip carrier for encapsulating the first semiconductor chip, the semiconductor package and the heat-dissipating element. 
 
     
     
       2. The structure of  claim 1 , wherein the heat-dissipating element is one of a black oxide treated copper foil and an anodized aluminum foil. 
     
     
       3. The structure of  claim 1 , wherein the heat-dissipating element further comprises a supporting portion extending downward from the flat portion such that the semiconductor package and the first semiconductor chip can be received in the receiving space formed by the flat portion and the supporting portion of the heat-dissipating element. 
     
     
       4. The structure of  claim 3 , wherein the heat-dissipating element is disposed on the top surface of the semiconductor package interposed with a heat conducting adhesive, and the supporting portion is disposed on the chip carrier through an adhesive. 
     
     
       5. The structure of  claim 3 , wherein the supporting portion of the heat-dissipating element is disposed on the ground portion of the chip carrier through an electrical conducting adhesive. 
     
     
       6. The structure of  claim 3 , wherein the supporting portion of the heat-dissipating element is disposed on the first semiconductor chip through an adhesive conducting heat but not electricity. 
     
     
       7. The structure of  claim 3 , wherein the heat-dissipating element has a plurality of supporting portions respectively disposed on the first semiconductor chip and the ground portion of the chip carrier. 
     
     
       8. The structure of  claim 1 , wherein the flat portion of the heat-dissipating element is exposed from the encapsulant. 
     
     
       9. The structure of  claim 1 , wherein the flat portion of the heat-dissipating element has a positioning portion for positioning the heat-dissipating element on the semiconductor package. 
     
     
       10. The structure of  claim 9 , wherein the positioning portion is one of a bending portion formed at edges of the flat portion and bending downward and a groove disposed on the flat portion.