Inventor · disambiguated record
Wen-Tsung Tseng
Also filed as: TSENG WEN-TSUNG
10 granted patents·12 pending applications·30 citations·filing 2006–2017
86Inventor score
Top patents by PatentIndex Score
22 records- 0185US9899308B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 20, 2018·4 cites·28 claims
- 0281US10199341B2Substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 5, 2019·4 cites·10 claims
- 0372US10049975B2Substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Aug 14, 2018·2 cites·7 claims
- 0470US9607939B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Mar 28, 2017·2 cites·21 claims
- 0569US8895366B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 25, 2014·2 cites·10 claims
- 0668US8008769B2Heat-dissipating semiconductor package structure and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Granted Aug 30, 2011·3 cites·10 claims
- 0767US7573722B2Electronic carrier board applicable to surface mounted technology (SMT)SILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Aug 11, 2009·9 cites·13 claims
- 0864US8698326B2Semiconductor package and fabrication method thereofHUANG WEN-HOME·Filed 2007·Granted Apr 15, 2014·4 cites·10 claims
- 0956US7889511B2Electronic carrier board applicable to surface mount technologySILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2009·Granted Feb 15, 2011·0 cites·23 claims
- 1049US2015035164A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1146US2011287588A1Method for manufacturing heat-dissipating semiconductor package structureTSENG WEN-TSUNG·Filed 2011·Application pending·0 cites
- 1246US2017148761A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 1345US2008122071A1Heat dissipating semiconductor package and fabrication method thereforSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 1445US2008122070A1Heat dissipating semiconductor package and fabrication method thereforSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 1544US2008017977A1Heat dissipating semiconductor package and heat dissipating structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 1644US2008213942A1Method for fabricating semiconductor device and carrier applied thereinSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 1743US2008006933A1Heat-dissipating package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 1842US8987012B2Method of testing a semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 24, 2015·0 cites·10 claims
- 1942US2006292741A1Heat-dissipating semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 2042US2007202633A1Semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 2141US2015035163A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2230US2017311445A1Electronic package and substrate structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →