Method for manufacturing heat-dissipating semiconductor package structure

Abstract

A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.

1 . A method for manufacturing a semiconductor package structure, comprising the steps of:
 providing a chip carrier and disposing on and electrically connecting to the chip carrier at least a semiconductor chip and at least a completed package unit;   providing a heat-dissipating element having a flat portion and disposing the flat portion of the heat-dissipating element on the top surface of the package unit; and   performing a package molding process so as to form an encapsulant encapsulating the package unit, the semiconductor chip and the heat-dissipating element, wherein the area of the flat portion of the heat-dissipating element is bigger than that of the top surface of the package unit such that the package unit can be covered by the flat portion of the heat-dissipating element.   
     
     
         2 . The method of  claim 1 , wherein the heat-dissipating element is one of a black oxide treated copper foil and an anodized aluminum foil. 
     
     
         3 . The method of  claim 1 , wherein the heat-dissipating element further comprises a supporting portion extending downward from the flat portion such that the package unit and the semiconductor chip can be received in the receiving space formed by the flat portion and the supporting portion of the heat-dissipating element. 
     
     
         4 . The method of  claim 3 , wherein the heat-dissipating element is disposed on the top surface of the package unit interposed with a heat conducting adhesive, and the supporting portion is disposed on the chip carrier through an adhesive. 
     
     
         5 . The method of  claim 3 , wherein the supporting portion of the heat-dissipating element is disposed on the ground portion of the chip carrier through an electrical conducting adhesive. 
     
     
         6 . The method of  claim 3 , wherein the supporting portion of the heat-dissipating element is disposed on the semiconductor chip through an adhesive conducting heat but not electricity. 
     
     
         7 . The method of  claim 3 , wherein the heat-dissipating element has a plurality of supporting portions respectively disposed on the semiconductor chip and the ground portion of the chip carrier. 
     
     
         8 . The method of  claim 1 , wherein the flat portion of the heat-dissipating element is exposed from the encapsulant. 
     
     
         9 . The method of  claim 1 , wherein the flat portion of the heat-dissipating element has a positioning portion for positioning the heat-dissipating element on the package unit. 
     
     
         10 . The method of  claim 9 , wherein the positioning portion is one of a bending portion formed at edges of the flat portion and bending downward and a groove disposed on the flat portion. 
     
     
         11 - 20 . (canceled)