Electronic carrier board applicable to surface mount technology

Abstract

An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a second sidewall of each of the two bond pads. The first sidewall is perpendicular to an alignment direction of the bond pads and the second sidewall is parallel to the alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the second sidewall of the at least one bond pad and a corresponding side of the corresponding opening.

1. An electronic carrier board comprising:
 a carrier; 
 at least two paired bond pads formed on a surface of the carrier; and 
 a protective layer covering the surface of the carrier and formed with openings corresponding in position to the at least two bond pads, wherein the openings are aligned in a same direction relative to an alignment direction of the at least two bond pads and expose at least a first sidewall and a second sidewall of each of the at least two bond pads, with the exposed first and second sidewalls of one of the at least two bond pads being identical to the exposed first and second sidewalls of the other one of the at least two bond pads, and wherein the first sidewalls of the bond pads are perpendicular to the alignment direction of the bond pads, and the second sidewalls of the bond pads are parallel to the alignment direction of the bond pads, and wherein a distance between the first sidewall of each of the bond pads and a corresponding side of a corresponding one of the openings is at least 50 μm larger than a distance between the second sidewall of each of the bond pads and a corresponding side of the corresponding opening. 
 
     
     
       2. The electronic carrier board of  claim 1 , wherein the bond pads allow solder paste to be applied thereon so as to electrical connect an electronic component to the bond pads via the solder paste, and one of the openings is located relatively closer to a center of the electronic component and has a distance to the first sidewall of a corresponding one of the bond pads larger than a distance to the second sidewall of the corresponding bond pad by at least 50 μm. 
     
     
       3. The electronic carrier board of  claim 2 , wherein the electronic component is a passive component, allowing a molding compound to encapsulate the passive component and fill a space under the passive components and the openings of the protective layer. 
     
     
       4. The electronic carrier board of  claim 1 , wherein at least one of the bond pads has a distance of at least 125 μm between its first sidewall and a corresponding side of a corresponding one of the openings, and has a distance of at least 75 μm between its second sidewall and a corresponding side of the corresponding opening. 
     
     
       5. The electronic carrier board of  claim 4 , wherein the bond pads are for mounting an electronic component thereon, and one of the openings is located relatively farther from a center of the electronic component and has a distance of at least 75 μm between a corresponding side thereof and the first sidewall of a corresponding one of the bond pads. 
     
     
       6. The electronic carrier board of  claim 1 , wherein at least one of the bond pads has a distance of at least 100 μm between its first sidewall and a corresponding side of a corresponding one of the openings, and has a distance of at least 50 μm between its second sidewall and a corresponding side of the corresponding opening. 
     
     
       7. The electronic carrier board of  claim 6 , wherein the bond pads are for mounting an electronic component thereon, and one of the openings is located relatively farther from a center of the electronic component and has a distance of at least 50 μm between a corresponding side thereof and the first sidewall of a corresponding one of the bond pads. 
     
     
       8. The electronic carrier board of  claim 1 , wherein the openings further exposes a third sidewall of each of the at least two bond pads, and the exposed third sidewall of one of the at least two bond pads is identical to the exposed third sidewall of the other one of the at least two bond pads, and wherein the third sidewalls of the bond pads are parallel to the alignment direction of the bond pads, and a distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least 50 μm larger than a distance between each of the second and third sidewalls of the at least one bond pad and a corresponding side of the corresponding opening. 
     
     
       9. An electronic carrier board comprising:
 a carrier; 
 at least two paired bond pads formed on a surface of the carrier; and 
 a protective layer covering the surface of the carrier and formed with openings corresponding in position to the at least two bond pads, wherein the openings are aligned in a same direction relative to an alignment direction of the at least two bond pads and completely expose a first sidewall, a second sidewall, a third sidewall and a fourth sidewall of each of the at least two bond pads, with the exposed first, second, third and fourth sidewalls of one of the at least two bond pads being identical to the exposed first, second, third and fourth sidewalls of the other one of the at least two bond pads, and wherein the first and fourth sidewalls of the bond pads are perpendicular to the alignment direction of the bond pads, and the second and third sidewalls of the bond pads are parallel to the alignment direction of the bond pads, and wherein a distance between the first sidewall of each of the bond pads and a corresponding side of a corresponding one of the openings is at least 50 μm larger than a distance between each of the second and third sidewalls of each of the bond pads and a corresponding side of the corresponding opening. 
 
     
     
       10. The electronic carrier board of  claim 9 , wherein the bond pads allow solder paste to be applied thereon so as to electrical connect an electronic component to the bond pads via the solder paste, and one of the openings is located relatively closer to a center of the electronic component and has a distance to the first sidewall of a corresponding one of the bond pads larger than a distance to the second sidewall of the corresponding bond pad by at least 50 μm. 
     
     
       11. The electronic carrier board of  claim 10 , wherein the electronic component is a passive component, allowing a molding compound to encapsulate the passive component and fill a space under the passive components and the openings of the protective layer. 
     
     
       12. The electronic carrier board of  claim 9 , wherein at least one of the bond pads has a distance of at least 125 μm between its first sidewall and a corresponding side of a corresponding one of the openings, and has a distance of at least 75 μm between its second sidewall and a corresponding side of the corresponding opening. 
     
     
       13. The electronic carrier board of  claim 12 , wherein the bond pads are for mounting an electronic component thereon, and one of the openings is located relatively farther from a center of the electronic component and has a distance of at least 75 μm between a corresponding side thereof and the first sidewall of a corresponding one of the bond pads. 
     
     
       14. The electronic carrier board of  claim 9 , wherein at least one of the bond pads has a distance of at least 100 μm between its first sidewall and a corresponding side of a corresponding one of the openings, and has a distance of at least 50 μm between its second sidewall and a corresponding side of the corresponding opening. 
     
     
       15. The electronic carrier board of  claim 14 , wherein the bond pads are for mounting an electronic component thereon, and one of the openings is located relatively farther from a center of the electronic component and has a distance of at least 50 μm between a corresponding side thereof and the first sidewall of a corresponding one of the bond pads. 
     
     
       16. The electronic carrier board of  claim 9 , further comprising at least one conductive circuit disposed on the surface of the carrier, wherein the at least one conductive circuit is located at one of a left side, a right side, an upper side, a lower side, the upper and lower sides, and at least one corner of at least one of the bond pads. 
     
     
       17. An electronic carrier board comprising:
 a carrier; 
 at least two paired bond pads formed on a surface of the carrier; and 
 a protective layer covering the surface of the carrier and formed with openings corresponding in position to the at least two bond pads, wherein the openings are aligned in a same direction relative to an alignment direction of the at least two bond pads and expose only a first sidewall of each of the at least two bond pads, and wherein the exposed first sidewall of one of the at least two bond pads is identical to the exposed first sidewall of the other one of the at least two bond pads, and the first sidewalls of the bond pads are perpendicular to the alignment direction of the bond pads. 
 
     
     
       18. The electronic carrier board of  claim 17 , wherein the bond pads allow solder paste to be applied thereon so as to electrical connect an electronic component to the bond pads via the solder paste. 
     
     
       19. The electronic carrier board of  claim 18 , wherein the electronic component is a passive component, allowing a molding compound to encapsulate the passive component and fill a space under the passive components and the openings of the protective layer. 
     
     
       20. The electronic carrier board of  claim 17 , wherein at least one of the bond pads has a distance of at least 125 μm between its first sidewall and a corresponding side of a corresponding one of the openings. 
     
     
       21. The electronic carrier board of  claim 20 , wherein the bond pads are for mounting an electronic component thereon, and one of the openings is located relatively farther from a center of the electronic component and has a distance of at least 75 μm between a corresponding side thereof and the first sidewall of a corresponding one of the bond pads. 
     
     
       22. The electronic carrier board of  claim 17 , wherein at least one of the bond pads has a distance of at least 100 μm between its first sidewall and a corresponding side of a corresponding one of the openings. 
     
     
       23. The electronic carrier board of  claim 22 , wherein the bond pads are for mounting an electronic component thereon, and one of the openings is located relatively farther from a center of the electronic component and has a distance of at least 50 μm between a corresponding side thereof and the first sidewall of a corresponding one of the bond pads.