Inventor · disambiguated record
Fang-Lin Tsai
Also filed as: TSAI FANG-LIN
12 granted patents·6 pending applications·32 citations·filing 2006–2025
85Inventor score
Top patents by PatentIndex Score
18 records- 0190US7855443B2Stack structure of semiconductor packages and method for fabricating the stack structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Dec 21, 2010·19 cites·4 claims
- 0271US2025279375A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 0369US12334452B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 0468US7696623B2Electronic carrier board and package structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Apr 13, 2010·3 cites·10 claims
- 0567US7573722B2Electronic carrier board applicable to surface mounted technology (SMT)SILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Aug 11, 2009·9 cites·13 claims
- 0662US8013443B2Electronic carrier board and package structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2010·Granted Sep 6, 2011·1 cites·10 claims
- 0759US12414232B2Substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·8 claims
- 0856US7889511B2Electronic carrier board applicable to surface mount technologySILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2009·Granted Feb 15, 2011·0 cites·23 claims
- 0951US10396021B2Fabrication method of layer structure for mounting semiconductor deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Aug 27, 2019·0 cites·8 claims
- 1051US9972564B2Layer structure for mounting semiconductor device and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 15, 2018·0 cites·7 claims
- 1150US2024282655A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1250US2024312889A1Electronic package and circuit structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1350US2024222290A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 1447US2007138632A1Electronic carrier board and package structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 1546US11791300B2Electronic package and circuit structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Oct 17, 2023·0 cites·11 claims
- 1642US2007202633A1Semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
- 1741US10236261B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Mar 19, 2019·0 cites·7 claims
- 1840US8420521B2Method for fabricating stack structure of semiconductor packagesTSAI FANG-LIN·Filed 2010·Granted Apr 16, 2013·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →