Electronic package and method for fabricating the same

Abstract

An electronic package is provided, which includes: a substrate; an electronic component and a shielding member disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic component and the shielding member; and a metal layer formed on the encapsulant and electrically connected to the shielding member. A portion of a surface of the shielding member is exposed from a side surface of the encapsulant and in contact with the metal layer. As such, the width of the shielding member can be reduced so as to reduce the amount of solder paste used for bonding the shielding member to the substrate, thereby overcoming the conventional drawback of poor solder distribution. The present disclosure further provides a method for fabricating the electronic package.

What is claimed is: 
     
       1. An electronic package, comprising:
 a substrate; 
 an electronic component disposed on the substrate; 
 a shielding member disposed on the substrate; 
 an encapsulant formed on the substrate and encapsulating the electronic component and the shielding member, with a portion of a surface of the shielding member exposed from a side surface of the encapsulant, wherein the side surface of the encapsulant is tilted relative to the substrate; and 
 a metal layer formed on the encapsulant and in contact with the portion of the surface of the shielding member exposed from the side surface of the encapsulant, 
 wherein the shielding member has a top portion and a wall portion bonded to the substrate and supporting the top portion, with a portion of a surface of the top portion being in contact with the metal layer, 
 wherein the top portion is wider than the wall portion, and 
 wherein the wall portion has a plurality of inner walls and a plurality of outer walls surrounding the inner walls, with a gap between adjacent ones of the inner walls being less than a gap between adjacent ones of the outer walls. 
 
     
     
       2. The electronic package of  claim 1 , wherein the encapsulant encapsulates the wall portion. 
     
     
       3. The electronic package of  claim 1 , further comprising another electronic component disposed on the substrate, wherein the inner walls are disposed between the electronic component and the another electronic component, and the encapsulant is formed between a portion of the top portion and the metal layer. 
     
     
       4. The electronic package of  claim 1 , wherein the shielding member further has a post portion supporting the top portion. 
     
     
       5. The electronic package of  claim 4 , wherein the wall portion and the post portion are alternately arranged. 
     
     
       6. The electronic package of  claim 1 , wherein the wall portion has a varying width in a longitudinal section. 
     
     
       7. The electronic package of  claim 1 , wherein the metal layer is further formed on the side surface of the encapsulant.