P

Inventor

WANG LUNG-YUAN

TW16 patents

Patents

16 patents
US9343387B2May 17, 2016

Package on package structure and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD7 citations79
US12368116B2Jul 22, 2025

Electronic package and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD2 citations72
US11973047B2Apr 30, 2024

Electronic package including electronic structure and electronic component

SILICONWARE PRECISION INDUSTRIES CO LTD2 citations70
US11152331B2Oct 19, 2021

Electronic package and method for fabricating the same

SILICONWARE PRECISION INDUSTRIES CO LTD4 citations70
US9356008B2May 31, 2016

Semiconductor package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD4 citations70
US12283560B2Apr 22, 2025

Electronic package including electronic structure and electronic body and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations61
US12009340B2Jun 11, 2024

Method for fabricating electronic package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations60
US12438079B2Oct 7, 2025

Electronic structure

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US11984393B2May 14, 2024

Electronic package, manufacturing method for the same, and electronic structure

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US9343421B2May 17, 2016

Semiconductor package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD2 citations57
US12114427B2Oct 8, 2024

Method for fabricating assemble substrate

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations56
US11382214B2Jul 5, 2022

Electronic package, assemble substrate, and method for fabricating the assemble substrate

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations56
US10163662B2Dec 25, 2018

Fabrication method of semiconductor package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations48
US9646921B2May 9, 2017

Semiconductor package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations48
US10236261B2Mar 19, 2019

Electronic package and method for fabricating the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations40
US9905546B2Feb 27, 2018

Package on package structure and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations34