Inventor · disambiguated record
Chih-Ming Huang
Also filed as: HUANG CHIH M · HUANG CHIH-MING
80 granted patents·59 pending applications·1,560 citations·filing 1997–2025
99Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD80HEWLETT PACKARD DEVELOPMENT CO10TONGFANG GLOBAL LTD5VASSTEK INT CORP4CHAN CHANG-YUEH3
Top patents by PatentIndex Score
139 records- 0199US6828665B2Module device of stacked semiconductor packages and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Dec 7, 2004·249 cites·14 claims
- 0298US6667546B2Ball grid array semiconductor package and substrate without power ring or ground ringSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Dec 23, 2003·218 cites·20 claims
- 0397US11500476B1Dual-transceiver based input devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Granted Nov 15, 2022·8 cites·20 claims
- 0496US7772685B2Stacked semiconductor structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Aug 10, 2010·44 cites·8 claims
- 0595US7173828B2Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Feb 6, 2007·106 cites·12 claims
- 0694US7170152B2Wafer level semiconductor package with build-up layer and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Jan 30, 2007·73 cites·11 claims
- 0794US6314379B1Integrated defect yield management and query systemTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Nov 6, 2001·173 cites·9 claims
- 0892US8420430B2Fabrication method of package structure having MEMS elementCHIU CHI-HSIN·Filed 2010·Granted Apr 16, 2013·17 cites·9 claims
- 0992US7423340B2Semiconductor package free of substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Sep 9, 2008·25 cites·12 claims
- 1091US6400014B1Semiconductor package with a heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jun 4, 2002·76 cites·12 claims
- 1190US9115886B2Rotary lighting fixture having speaker with playback functionTONGFANG GLOBAL LTD·Filed 2013·Granted Aug 25, 2015·13 cites·8 claims
- 1290US7816187B2Method for fabricating semiconductor package free of substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Granted Oct 19, 2010·16 cites·14 claims
- 1390USD529031SIC card type circuit moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Sep 26, 2006·41 cites·1 claims
- 1488US7271024B2Method for fabricating sensor semiconductor deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Sep 18, 2007·14 cites·8 claims
- 1588US7160261B1Back sliding massagerHUANG CHIH-MING·Filed 2006·Granted Jan 9, 2007·28 cites·5 claims
- 1687US7445957B2Method for fabricating wafer level semiconductor package with build-up layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Nov 4, 2008·13 cites·14 claims
- 1785US7508066B2Heat dissipating semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Mar 24, 2009·12 cites·6 claims
- 1885US6884652B2Semiconductor package free of substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Apr 26, 2005·35 cites·12 claims
- 1985US6847104B2Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jan 25, 2005·42 cites·17 claims
- 2083US12278189B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·15 claims
- 2183US8183092B2Method of fabricating stacked semiconductor structureHUANG CHIEN-PING·Filed 2010·Granted May 22, 2012·6 cites·14 claims
- 2283US7679178B2Semiconductor package on which a semiconductor device can be stacked and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Mar 16, 2010·11 cites·26 claims
- 2383US7342318B2Semiconductor package free of substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Mar 11, 2008·10 cites·14 claims
- 2482USD711383SDisplay connectorTONGFANG GLOBAL LTD·Filed 2014·Granted Aug 19, 2014·28 cites·1 claims
- 2582USD498760SDigital memory cardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Nov 23, 2004·28 cites·1 claims
- 2681US7446307B2Sensor semiconductor device and fabrication method of the sensor semiconductor deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Nov 4, 2008·10 cites·14 claims
- 2780US8546183B2Method for fabricating heat dissipating semiconductor packageHUANG CHIEN-PING·Filed 2008·Granted Oct 1, 2013·9 cites·14 claims
- 2880US2025210527A1Electronic Package and Manufacturing Method ThereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 2979US11810862B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·13 claims
- 3079USD492314SIC card type circuit moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jun 29, 2004·24 cites·1 claims
- 3176US7939383B2Method for fabricating semiconductor package free of substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted May 10, 2011·6 cites·16 claims
- 3276US7005720B2Semiconductor package with photosensitive chip and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Feb 28, 2006·22 cites·20 claims
- 3375US8367926B2Electronic apparatus and cover mechanismHON HAI PREC IND CO LTD·Filed 2010·Granted Feb 5, 2013·8 cites·9 claims
- 3475US7354796B2Method for fabricating semiconductor package free of substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Apr 8, 2008·5 cites·14 claims
- 3574US7365364B2Sensor semiconductor device with sensor chipSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Apr 29, 2008·5 cites·8 claims
- 3673US8618641B2Leadframe-based semiconductor packageCHAN CHANG-YUEH·Filed 2008·Granted Dec 31, 2013·6 cites·28 claims
- 3773US6703698B2Semiconductor package with enhanced electrical and thermal performance and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Mar 9, 2004·17 cites·13 claims
- 3873US2025246502A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 3972US11521930B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 6, 2022·0 cites·14 claims
- 4072US9124861B2Display connector with 4K image resolutionTONGFANG GLOBAL LTD·Filed 2014·Granted Sep 1, 2015·3 cites·10 claims
- 4172US8716070B2Fabrication method of package structure having MEMS elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 6, 2014·2 cites·26 claims
- 4272US6830957B2Method of fabricating BGA packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Dec 14, 2004·18 cites·13 claims
- 4371US9165589B1Voice coil motor with lateral attraction forceVASSTEK INT CORP·Filed 2015·Granted Oct 20, 2015·3 cites·10 claims
- 4469US8304891B2Semiconductor package device, semiconductor package structure, and fabrication methods thereofCHIANG CHENG-CHIA·Filed 2008·Granted Nov 6, 2012·5 cites·11 claims
- 4568US7696623B2Electronic carrier board and package structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Apr 13, 2010·3 cites·10 claims
- 4668US2023361091A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Application pending·0 cites
- 4767US12216281B2Position-based switch of display devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Feb 4, 2025·0 cites·17 claims
- 4867US8198689B2Package structure having micro-electromechanical element and fabrication method thereofCHAN CHANG-YUEH·Filed 2010·Granted Jun 12, 2012·2 cites·9 claims
- 4967US7573722B2Electronic carrier board applicable to surface mounted technology (SMT)SILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Aug 11, 2009·9 cites·13 claims
- 5066US6972216B2Semiconductor package with enhanced electrical and thermal performance and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Dec 6, 2005·11 cites·7 claims
Showing the top 50 of 139 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →