Electronic package and manufacturing method thereof

Abstract

An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

What is claimed is: 
     
       1. A method for manufacturing an electronic package, comprising:
 providing a circuit board and at least one circuit block at a distance from one another on a carrier board, wherein the circuit board is formed with a plurality of grooves such that the plurality of grooves form a cross-shaped groove structure; 
 forming an encapsulating layer on the carrier board for encapsulating the circuit board and the circuit block, wherein the encapsulating layer has a first surface and a second surface opposite to each other, and the encapsulating layer is bonded onto the carrier board via the second surface; 
 forming a first circuit structure on the first surface of the encapsulating layer, the first circuit structure being electrically connected with the circuit board and the circuit block; 
 disposing an electronic component on the first circuit structure, the electronic component being electrically connected with the first circuit structure; 
 removing the carrier board; and 
 forming a second circuit structure on the second surface of the encapsulating layer, the second circuit structure being electrically connected with the circuit board and the circuit block. 
 
     
     
       2. The method of  claim 1 , wherein a plurality of circuit blocks are embedded in the encapsulating layer at a distance to one another. 
     
     
       3. The method of  claim 1 , wherein the circuit board and the circuit block are spaced apart from each other. 
     
     
       4. The method of  claim 1 , wherein the circuit board is provided with a receiving space for receiving the circuit block, and the encapsulating layer is further formed in the receiving space to encapsulate the circuit block. 
     
     
       5. The method of  claim 1 , wherein the encapsulating layer is formed in the grooves. 
     
     
       6. The method of  claim 1 , wherein a plurality of conductive structures are embedded in the encapsulating layer. 
     
     
       7. The method of  claim 1 , further comprising encapsulating the electronic component with a packaging layer. 
     
     
       8. The method of  claim 1 , further comprising forming a plurality of conductive components on the second circuit structure. 
     
     
       9. The method of  claim 1 , wherein the circuit block has at least an insulating body or at least one semiconductor base and at least one conductive pillar embedded in the insulating body or the semiconductor base. 
     
     
       10. The method of  claim 9 , wherein the insulating body is an encapsulant, and the semiconductor base includes silicon. 
     
     
       11. The method of  claim 9 , further comprising forming a circuit portion electrically connected with the conductive pillar on at least one of the two opposite sides of the insulating body or the semiconductor base. 
     
     
       12. The method of  claim 1 , wherein the circuit board is a coreless circuit structure. 
     
     
       13. The method of  claim 1 , wherein a plurality of electronic components are provided on the first circuit structure, and a gap is formed between at least two of the plurality of electronic components, such that the circuit block is positioned in the gap for electrically bridging the two electronic components.