Inventor · disambiguated record
Yu-Lung Huang
Also filed as: HUANG YU-LUNG
40 granted patents·8 pending applications·104 citations·filing 2009–2025
96Inventor score
Files withXINTEC INC22SILICONWARE PRECISION INDUSTRIES CO LTD19HUANG YU-LUNG3YEN YU-LIN2IND TECH RES INST1
Top patents by PatentIndex Score
48 records- 0196US8741683B2Chip package and fabrication method thereofXINTEC INC·Filed 2013·Granted Jun 3, 2014·24 cites·12 claims
- 0291US8952501B2Chip package and method for forming the sameXINTEC INC·Filed 2013·Granted Feb 10, 2015·14 cites·27 claims
- 0390US8963312B2Stacked chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Feb 24, 2015·11 cites·23 claims
- 0489US11482470B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Oct 25, 2022·2 cites·16 claims
- 0585US10863626B1Electronic package carrier structure thereof, and method for fabricating the carrier structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Dec 8, 2020·3 cites·12 claims
- 0684US9355975B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted May 31, 2016·6 cites·18 claims
- 0783US12278189B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·15 claims
- 0881US8890268B2Chip package and fabrication method thereofHUANG YU-LUNG·Filed 2011·Granted Nov 18, 2014·5 cites·16 claims
- 0980US2025210527A1Electronic Package and Manufacturing Method ThereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 1079US11810862B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·13 claims
- 1179US8692358B2Image sensor chip package and method for forming the sameHUANG YU-LUNG·Filed 2011·Granted Apr 8, 2014·5 cites·8 claims
- 1277US12205906B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·11 claims
- 1377US11069661B1Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Jul 20, 2021·1 cites·18 claims
- 1477US9881889B2Chip package and method for fabricating the sameXINTEC INC·Filed 2014·Granted Jan 30, 2018·4 cites·18 claims
- 1576US8581386B2Chip packageYEN YU-LIN·Filed 2012·Granted Nov 12, 2013·4 cites·20 claims
- 1675US9947716B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Apr 17, 2018·2 cites·10 claims
- 1775US9209124B2Chip packageXINTEC INC·Filed 2013·Granted Dec 8, 2015·3 cites·26 claims
- 1874US10152180B2Chip scale sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Granted Dec 11, 2018·2 cites·28 claims
- 1974US9711425B2Sensing module and method for forming the sameXINTEC INC·Filed 2016·Granted Jul 18, 2017·2 cites·22 claims
- 2074US9136241B2Chip package and manufacturing method thereofYEN YU-LIN·Filed 2012·Granted Sep 15, 2015·4 cites·24 claims
- 2173US12100642B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Sep 24, 2024·0 cites·17 claims
- 2273US9287417B2Semiconductor chip package and method for manufacturing thereofXINTEC INC·Filed 2014·Granted Mar 15, 2016·3 cites·18 claims
- 2373US2025246502A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 2472US11521930B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 6, 2022·0 cites·14 claims
- 2568US10950520B2Electronic package, method for fabricating the same, and heat dissipatorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Mar 16, 2021·1 cites·27 claims
- 2668US9437478B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Sep 6, 2016·2 cites·27 claims
- 2768US9425134B2Chip packageXINTEC INC·Filed 2014·Granted Aug 23, 2016·2 cites·21 claims
- 2866US11792938B2Method for fabricating carrier structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Oct 17, 2023·0 cites·9 claims
- 2965US11984379B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted May 14, 2024·0 cites·26 claims
- 3065US10109663B2Chip package and method for forming the sameXINTEC INC·Filed 2016·Granted Oct 23, 2018·1 cites·22 claims
- 3165US9355970B2Chip package and method for forming the sameXINTEC INC·Filed 2015·Granted May 31, 2016·1 cites·9 claims
- 3264US11881459B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Jan 23, 2024·0 cites·11 claims
- 3363US9620431B2Chip package including recess in side edgeXINTEC INC·Filed 2015·Granted Apr 11, 2017·1 cites·32 claims
- 3463US9006896B2Chip package and method for forming the sameXINTEC INC·Filed 2013·Granted Apr 14, 2015·1 cites·26 claims
- 3560US12400931B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 3660US11605554B2Flip-chip process and bonding equipmentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Mar 14, 2023·0 cites·8 claims
- 3760US2023210149A1Method of preparing fermented food by using novel rhizopus microsporus strain, and fermented foodIND TECH RES INST·Filed 2022·Application pending·0 cites
- 3859US12080618B2Electronic package, heat dissipation structure and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·27 claims
- 3959US11410954B2Electronic package, manufacturing method thereof and conductive structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 9, 2022·0 cites·16 claims
- 4051US8785247B2Chip package and method for forming the sameXINTEC INC·Filed 2013·Granted Jul 22, 2014·0 cites·20 claims
- 4151US2014154830A1Image sensor chip package and method for forming the sameXINTEC INC·Filed 2014·Application pending·0 cites
- 4249US8508028B2Chip package and method for forming the sameHUANG YU-LUNG·Filed 2011·Granted Aug 13, 2013·0 cites·12 claims
- 4346US2024234272A9Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Application pending·0 cites
- 4445US10140498B2Wafer-level packaging sensing device and method for forming the sameXINTEC INC·Filed 2016·Granted Nov 27, 2018·0 cites·19 claims
- 4545US2011145620A1Method of using power supply to perform far-end monitoring of electronic systemSHIH TSUN-TE·Filed 2009·Application pending·0 cites
- 4643US9865526B2Chip package and method for forming the sameXINTEC INC·Filed 2015·Granted Jan 9, 2018·0 cites·22 claims
- 4742US2013193571A1Semiconductor package and method and system for fabricating the sameXINTEC INC·Filed 2013·Application pending·0 cites
- 4836US2016351608A1Chip package and method of manufacturing the sameXINTEC INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →