Inventor

TSAI HO-YI

TW26 patents

⚠️ This page may combine multiple inventors who share the name “TSAI HO-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI HO-YI

SILICONWARE PRECISION INDUSTRIES CO LTD

Leadframe-based semiconductor package for multi-media card

Bump structure of semiconductor package and method for fabricating the same

Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure

Thermally enhanced semiconductor package with EMI shielding

Stack structure of semiconductor packages and method for fabricating the stack structure

Method for fabricating semiconductor package with heat sink

Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof

Semiconductor package with heat sink and method for fabricating same

Electronic carrier board applicable to surface mounted technology (SMT)

Semiconductor device with reinforced under-support structure and method of fabricating the same

Heat dissipation semiconductor package

Heat-dissipating semiconductor package structure and method for manufacturing the same

Electronic carrier board and package structure thereof

Method for fabricating semiconductor packages

Method for fabricating semiconductor packages

Leadframe-based semiconductor package for multi-media card

Fabrication method of semiconductor package

Interconnection structure for semiconductor package

Semiconductor package and a substrate for packaging

Substrate structure and semiconductor package using the same

Electronic carrier board and package structure thereof

Electronic carrier board applicable to surface mount technology

Method for fabricating heat dissipation package structure

HUANG WEN-HOME

Semiconductor package and fabrication method thereof

LIN CHANG-FU

Semiconductor package and a substrate for packaging

TSAI FANG-LIN

Method for fabricating stack structure of semiconductor packages