Inventor
HO CHIH-WEI
TW25 patents
⚠️ This page may combine multiple inventors who share the name “HO CHIH-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
10 patentsUS6403368B1Jun 11, 2002
On-spot hydrophilic enhanced slide and preparation thereof
IND TECH RES INST47 citations94
US6733894B2May 11, 2004
High-density functional slide and preparation method thereof
IND TECH RES INST22 citations91
US6605363B2Aug 12, 2003
High-density functional slide and preparation method thereof
IND TECH RES INST17 citations91
US6528291B1Mar 4, 2003
Activated inorganic slide having aldehyde groups deposited by plasma deposition
IND TECH RES INST11 citations72
US7150856B2Dec 19, 2006
On-spot selectively activated hydrophobic slide and preparation thereof
IND TECH RES INST2 citations62
US7105340B2Sep 12, 2006
On-spot selectively activated hydrophobic slide and preparation thereof
IND TECH RES INST2 citations62
US6960468B2Nov 1, 2005
On-spot hydrophilic enhanced slide and preparation thereof
IND TECH RES INST1 citations61
US7118908B2Oct 10, 2006
On-spot selectively activated hydrophobic slide and preparation thereof
IND TECH RES INST0 citations51
US6974529B2Dec 13, 2005
Hand-held electrophoresis detection device and support thereof
IND TECH RES INST1 citations50
US7157269B2Jan 2, 2007
On-spot hydrophilic enhanced slide and preparation thereof
IND TECH RES INST0 citations49
SAS INST INC
4 patentsUS9703789B2Jul 11, 2017
Distributed data set storage and retrieval
SAS INST INC14 citations91
US9619148B2Apr 11, 2017
Distributed data set storage and retrieval
SAS INST INC9 citations82
US9811524B2Nov 7, 2017
Distributed data set storage and retrieval
SAS INST INC1 citations61
US10185721B2Jan 22, 2019
Distributed data set storage and retrieval
SAS INST INC0 citations51
XINTEC INC
4 patentsUS9633935B2Apr 25, 2017
Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same
XINTEC INC5 citations73
US9153528B2Oct 6, 2015
Chip package and method for forming the same
XINTEC INC0 citations52
US9613904B2Apr 4, 2017
Semiconductor structure and manufacturing method thereof
XINTEC INC0 citations51
US9230927B2Jan 5, 2016
Method of fabricating wafer-level chip package
XINTEC INC1 citations47