Inventor · disambiguated record
Thomas Matthew Gregorich
Also filed as: GREGORICH THOMAS · GREGORICH THOMAS MATTHEW
17 granted patents·3 pending applications·45 citations·filing 2011–2024
92Inventor score
Top patents by PatentIndex Score
20 records- 0187US8633588B2Semiconductor packageLIN TZU-HUNG·Filed 2011·Granted Jan 21, 2014·8 cites·20 claims
- 0287US8390119B2Flip chip package utilizing trace bump trace interconnectionLIN TZU-HUNG·Filed 2011·Granted Mar 5, 2013·7 cites·20 claims
- 0384US9142526B2Semiconductor package with solder resist capped trace to prevent underfill delaminationMEDIATEK INC·Filed 2013·Granted Sep 22, 2015·5 cites·20 claims
- 0482US11121108B2Flip chip package utilizing trace bump trace interconnectionMEDIATEK INC·Filed 2020·Granted Sep 14, 2021·1 cites·21 claims
- 0581US9640505B2Semiconductor package with trace covered by solder resistMEDIATEK INC·Filed 2015·Granted May 2, 2017·3 cites·18 claims
- 0680US11817231B2Detection system for X-ray inspection of an objectZEISS CARL SMT GMBH·Filed 2021·Granted Nov 14, 2023·1 cites·26 claims
- 0777US9437512B2Integrated circuit package structureGREGORICH THOMAS MATTHEW·Filed 2012·Granted Sep 6, 2016·5 cites·9 claims
- 0877US8859340B2Molded interposer package and method for fabricating the sameMEDIATEK INC·Filed 2014·Granted Oct 14, 2014·3 cites·1 claims
- 0976US10707183B2Flip chip package utilizing trace bump trace interconnectionMEDIATEK INC·Filed 2019·Granted Jul 7, 2020·1 cites·20 claims
- 1075US9064757B2Enhanced flip chip structure using copper column interconnectGREGORICH THOMAS MATTHEW·Filed 2012·Granted Jun 23, 2015·4 cites·7 claims
- 1173US9659893B2Semiconductor packageMEDIATEK INC·Filed 2015·Granted May 23, 2017·2 cites·20 claims
- 1272US8502377B2Package substrate for bump on trace interconnectionLIN TZU-HUNG·Filed 2011·Granted Aug 6, 2013·2 cites·20 claims
- 1367US10354970B2Flip chip package utilizing trace bump trace interconnectionMEDIATEK INC·Filed 2013·Granted Jul 16, 2019·1 cites·18 claims
- 1466US2024295507A1Imaging optical arrangement to image an object illuminated by x-raysZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1565US9040359B2Molded interposer package and method for fabricating the sameMEDIATEK INC·Filed 2014·Granted May 26, 2015·1 cites·13 claims
- 1663US8957518B2Molded interposer package and method for fabricating the sameGREGORICH THOMAS MATTHEW·Filed 2012·Granted Feb 17, 2015·1 cites·25 claims
- 1756US2024282722A1Ball grid array rf package configurationsINFINERA CORP·Filed 2023·Application pending·0 cites
- 1850US11935228B2Method to acquire a 3D image of a sample structureZEISS CARL SMT GMBH·Filed 2021·Granted Mar 19, 2024·0 cites·26 claims
- 1941US9437534B2Enhanced flip chip structure using copper column interconnectMEDIATEK INC·Filed 2015·Granted Sep 6, 2016·0 cites·7 claims
- 2033US2012140427A1Printed circuit board (pcb) assembly with advanced quad flat no-lead (a-qfn) packageGREGORICH THOMAS MATTHEW·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →