Inventor · disambiguated record
Dung-Ching Perng
Also filed as: PERNG DUNG-CHING
12 granted patents·3 pending applications·721 citations·filing 1997–2011
94Inventor score
Top patents by PatentIndex Score
15 records- 0196US6004880AMethod of single step damascene process for deposition and global planarizationLSI LOGIC CORP·Filed 1998·Granted Dec 21, 1999·224 cites·14 claims
- 0294US6090239AMethod of single step damascene process for deposition and global planarizationLSI LOGIC CORP·Filed 1999·Granted Jul 18, 2000·144 cites·8 claims
- 0391US6423630B1Process for forming low K dielectric material between metal linesLSI LOGIC CORP·Filed 2000·Granted Jul 23, 2002·66 cites·20 claims
- 0491US6365452B1DRAM cell having a vertical transistor and a capacitor formed on the sidewalls of a trench isolationLSI LOGIC CORP·Filed 2000·Granted Apr 2, 2002·59 cites·21 claims
- 0586US6090661AFormation of novel DRAM cell capacitors by integration of capacitors with isolation trench sidewallsLSI LOGIC CORP·Filed 1998·Granted Jul 18, 2000·73 cites·14 claims
- 0683US6149987AMethod for depositing low dielectric constant oxide filmsAPPLIED MATERIALS INC·Filed 1998·Granted Nov 21, 2000·61 cites·14 claims
- 0776US6177699B1DRAM cell having a verticle transistor and a capacitor formed on the sidewalls of a trench isolationLSI LOGIC CORP·Filed 1998·Granted Jan 23, 2001·42 cites·21 claims
- 0873US6794698B1Formation of novel DRAM cell capacitors by integration of capacitors with isolation trench sidewallsLSI LOGIC CORP·Filed 2000·Granted Sep 21, 2004·18 cites·16 claims
- 0957US6523494B1Apparatus for depositing low dielectric constant oxide filmAPPLIED MATERIALS INC·Filed 2000·Granted Feb 25, 2003·5 cites·17 claims
- 1056US6033997AReduction of black silicon in semiconductor fabricationSIEMENS AG·Filed 1997·Granted Mar 7, 2000·20 cites·1 claims
- 1153US2012167979A1Thin film solar cell and method for manufacturing the samePERNG DUNG-CHING·Filed 2011·Application pending·0 cites
- 1240US2004227243A1Methods of pore sealing and metal encapsulation in porous low k interconnectFiled 2004·Application pending·0 cites
- 1339US2004229453A1Methods of pore sealing and metal encapsulation in porous low k interconnectJSR MICRO INC·Filed 2003·Application pending·0 cites
- 1436US6066570AMethod and apparatus for preventing formation of black silicon on edges of wafersSIEMENS AG·Filed 1998·Granted May 23, 2000·5 cites·20 claims
- 1534US6369418B1Formation of a novel DRAM cellLSI LOGIC CORP·Filed 1998·Granted Apr 9, 2002·4 cites·22 claims
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