Inventor

KWON HEUNG-KYU

KR47 patents

⚠️ This page may combine multiple inventors who share the name “KWON HEUNG-KYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KWON HEUNG-KYU

SAMSUNG ELECTRONICS CO LTD

Chip scale packages and methods for manufacturing the chip scale packages at wafer level

Semiconductor device package

Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor package

Method for manufacturing flip chip package devices with a heat spreader

Semiconductor package

Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same

Semiconductor package with ground projections

System on package (SoP) having through silicon via (TSV) interposer with memory controller connected to multiple printed circuit boards (PCB)

Stack package, a method of manufacturing the stack package, and a digital device having the stack package

Stack semiconductor package including an interposer chip having an imposed diode or capacitor

Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability

Multi-chip package including at least one semiconductor device enclosed therein

High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same

Chip scale packages manufactured at wafer level

Semiconductor packages having warpage compensation

Stacked semiconductor package including connections electrically connecting first and second semiconductor packages

Semiconductor device package

Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same

System module and mobile computing device including the same

Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability

Stack packages having fastening element and halogen-free inter-package connector

Semiconductor chip package having one or more sealing screws

Stacked semiconductor packages

Method of fabricating a semiconductor package

Apparatus for stacked semiconductor packages and methods of fabricating the same

Semiconductor chip, flip chip package and wafer level package including the same

Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements

High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same

Stacked semiconductor package including connections electrically connecting first and second semiconductor packages

Method for fabricating a flip chip system in package

Method for fabricating a flip chip system in package

Bonding configurations for lead-frame-based and substrate-based semiconductor packages

KWON HEUNG-KYU

Systems employing a stacked semiconductor package

Semiconductor packages having warpage compensation

Stacked semiconductor packages

Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor package

Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements

Semiconductor packages having passive elements mounted thereonto

Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device

Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor device

KWON HEUNG KYU

System of package (SoP) module and mobile computing device having the SoP

Package on packages and mobile computing devices having the same

Semiconductor device having markings and package on package including the same

Semiconductor package and method for routing the package

KIM TONG-SUK

Semiconductor package having multi pitch ball land

Semiconductor package having multi pitch ball land

SAMSUNG ELELCTRONICS CO LTD

Semiconductor package