Inventor
LIN YI-HANG
TW13 patents
⚠️ This page may combine multiple inventors who share the name “LIN YI-HANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
8 patentsUS9929128B1Mar 27, 2018
Chip package structure with adhesive layer
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US12368080B2Jul 22, 2025
Chip package structure with ring structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11728233B2Aug 15, 2023
Chip package structure with ring structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10964594B2Mar 30, 2021
Methods of packaging semiconductor devices including placing semiconductor devices into die caves
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9673098B2Jun 6, 2017
Methods of packaging semiconductor devices and structures thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10163875B2Dec 25, 2018
Method for forming chip package structure with adhesive layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163711B2Dec 25, 2018
Methods of packaging semiconductor devices including placing semiconductor devices into die caves
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9406581B2Aug 2, 2016
Methods of packaging semiconductor devices and structures thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51