Inventor

CAHILL SEAN S

US23 patents

⚠️ This page may combine multiple inventors who share the name “CAHILL SEAN S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CAHILL SEAN S

ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO KG

Coated bond wires for die packages and methods of manufacturing said coated bond wires

Heat isolation structures for high bandwidth interconnects

Die package with low electromagnetic interference interconnection

Die packaging with fully or partially fused dielectric leads

Electronic device having a lead with selectively modified electrical properties

Mixed impedance leads for die packages and method of making the same

Substrate less die package having wires with dielectric and metal coatings and the method of manufacturing the same

MAXIM INTEGRATED PRODUCTS

Hermetic packaging for semiconductor pressure sensors

Compensated semiconductor pressure sensor

Chip-scale packaged pressure sensor

Piezoresistive pressure sensor with sculpted diaphragm

Micromachined circuit elements driven by micromachined DC-to-DC converter on a common substrate

SANJUAN ERIC A

Low cost high frequency device package and methods

Method of making a high frequency device package

Low cost high frequency device package and methods

YAZAKI METER CO LTD

Semiconductor sensor anodic-bonding process, wherein bonding of corrugation is prevented

Semiconductor sensor manufactured through anodic-bonding process

Method for forming a semiconductor sensor

TOKYO GAS CO LTD

Varying apparent mass accelerometer

Preloaded linear beam vibration sensor and its manufacturing method

NEUKERMANS ARMAND P

Method of making superhard tips for micro-probe microscopy and field emission

PARK SCIENT INSTR CORP

Piezoresistive cantilever with integral tip for scanning probe microscope

CAHILL SEAN S

Metalized molded plastic components for millimeter wave electronics and method for manufacture