Inventor
JACKSON RAYMOND A
US24 patents
Patents
24 patentsUS6333563B1Dec 25, 2001
Electrical interconnection package and method thereof
IBM85 citations97
US6335210B1Jan 1, 2002
Baseplate for chip burn-in and/of testing, and method thereof
IBM64 citations96
US6283359B1Sep 4, 2001
Method for enhancing fatigue life of ball grid arrays
IBM53 citations96
US5968670AOct 19, 1999
Enhanced ceramic ball grid array using in-situ solder stretch with spring
IBM63 citations96
US6541305B2Apr 1, 2003
Single-melt enhanced reliability solder element interconnect
IBM23 citations93
US6719188B2Apr 13, 2004
Rework methods for lead BGA/CGA
IBM20 citations92
US6458623B1Oct 1, 2002
Conductive adhesive interconnection with insulating polymer carrier
IBM45 citations92
US6278184B1Aug 21, 2001
Solder disc connection
IBM35 citations92
US6253986B1Jul 3, 2001
Solder disc connection
IBM25 citations92
US6216937B1Apr 17, 2001
Process and apparatus to remove closely spaced chips on a multi-chip module
IBM31 citations92
US6158644ADec 12, 2000
Method for enhancing fatigue life of ball grid arrays
IBM43 citations92
US6070321AJun 6, 2000
Solder disc connection
IBM20 citations92
US5975409ANov 2, 1999
Ceramic ball grid array using in-situ solder stretch
IBM36 citations92
US5964396AOct 12, 1999
Enhanced ceramic ball grid array using in-situ solder stretch with clip
IBM36 citations92
US5553766ASep 10, 1996
In-situ device removal for multi-chip modules
IBM31 citations92
US5543584AAug 6, 1996
Structure for repairing electrical lines
IBM21 citations92
US5153408AOct 6, 1992
Method and structure for repairing electrical lines
IBM33 citations92
US6528352B1Mar 4, 2003
Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications
IBM20 citations91
US6548175B2Apr 15, 2003
Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
IBM48 citations90
US5493076AFeb 20, 1996
Structure for repairing semiconductor substrates
IBM21 citations90
US5446961ASep 5, 1995
Method for repairing semiconductor substrates
IBM26 citations90
US5605277AFeb 25, 1997
Hot vacuum device removal process and apparatus
IBM18 citations83
US6360938B2Mar 26, 2002
Process and apparatus to remove closely spaced chips on a multi-chip module
IBM12 citations73
US6497357B2Dec 24, 2002
Apparatus and method for removing interconnections
IBM8 citations71