Structure for repairing semiconductor substrates

Abstract

The present invention relates generally to a new structure and a method for repairing semiconductor substrates, and more particularly, the invention encompasses a structure and a method for repairing Printed Circuit Boards or other electronic substrates by providing electrical lines on the defective board. On a substrate that has an open or an electrical discontinuity, after the discontinuity has been established, a portion of the electrical line across from the electrical discontinuity are exposed and one or more trenches or grooves are made between the two or more exposed portions of the electrical line. The two exposed portions of the exposed electrical line is then joined by either an electrical wire that is routed through the trench or using a standard deposition process one or more metals or material are deposited in the open trench to provide or restore electrical continuity and the excess deposition material is removed. This invention also provides means for impedance matching of the net that is repaired.

What is claimed is: 
     
       1. A repaired structure comprising a carrier having at least one electrical line having a discontinuity and forming at least one first segment and at least one second segment, at least a portion of said first segment and at least a portion of said second segment are exposed, at least one trench in said carrier between the exposed sections of said first segment and said second segment, an electrical connection having a first end and a second end routed through said trench and wherein said first end is secured to at least a portion of said exposed first segment and wherein said second end is secured to at least a portion of said exposed second segment to provide electrical continuity to said defective electrical line and thereby providing said repaired structure. 
     
     
       2. The repaired structure of claim 1, wherein said electrical connection is at least one electrically conductive wire. 
     
     
       3. The repaired structure of claim 1, wherein said electrical connection is at least one electrically conductive media. 
     
     
       4. The repaired structure of claim 3, wherein said electrically conductive media is selected from a group consisting of electrically conductive polymer or an electrically conductive epoxy or an electrically conductive adhesive or an electrically conductive organometallic material. 
     
     
       5. The repaired structure of claim 1, wherein the material for said electrical connection is selected from a group comprising aluminum, antimony, bismuth, chromium, cobalt, copper, gold, indium, iron, lead, molybdenum, nickel, palladium, platinum, silver, tantalum, tin, titanium, tungsten, or alloys thereof. 
     
     
       6. The repaired structure of claim 3, wherein the material for said electrically conductive media is selected from a group comprising aluminum, antimony, bismuth, chromium, cobalt, copper, gold, indium, iron, lead, molybdenum, nickel, palladium, platinum, silver, tantalum, tin, titanium, tungsten, or alloys thereof. 
     
     
       7. The repaired structure of claim 3, wherein said electrically conductive media is selected from a group comprising solder, solder coated metal, or a metal covered with a low temperature electrically conductive material or a foil or a flat wire or a rectangular type wire. 
     
     
       8. The repaired structure of claim 1, wherein said electrical connection is a low temperature electrically conductive material. 
     
     
       9. The repaired structure of claim 1, wherein at least a portion of said electrical connection has a coating of at least one low temperature electrically conductive material. 
     
     
       10. The repaired structure of claim 9, wherein said at least one low temperature electrically conductive material is solder. 
     
     
       11. The repaired structure of claim 1, wherein at least a portion of said electrical connection has a coating of at least one insulator material. 
     
     
       12. The repaired structure of claim 1, wherein at least a portion of said electrical connection has a coating of at least one polymer material. 
     
     
       13. The repaired structure of claim 1, wherein said carrier has at least one second trench having at least one second electrical connection to provide impedance matching.