Inventor · disambiguated record
Atsuhiko Sugimoto
Also filed as: SUGIMOTO ATSUHIKO
12 granted patents·11 pending applications·57 citations·filing 2004–2018
88Inventor score
Top patents by PatentIndex Score
23 records- 0191US10470300B1Glass panel for wiring board and method of manufacturing wiring boardAGC INC·Filed 2018·Granted Nov 5, 2019·9 cites·32 claims
- 0288US7122894B2Wiring substrate and process for manufacturing the sameNGK SPARK PLUG CO·Filed 2005·Granted Oct 17, 2006·19 cites·9 claims
- 0382US8707554B2Method of manufacturing multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2010·Granted Apr 29, 2014·6 cites·6 claims
- 0481US9059152B2Wiring substrate and manufacturing method of the sameNGK SPARK PLUG CO·Filed 2012·Granted Jun 16, 2015·6 cites·7 claims
- 0580US8581388B2Multilayered wiring substrateMAEDA SHINNOSUKE·Filed 2010·Granted Nov 12, 2013·6 cites·15 claims
- 0665US8319111B2Wiring board having wiring laminate portion with via conductors embedded in resin insulating layersSAIKI HAJIME·Filed 2007·Granted Nov 27, 2012·5 cites·24 claims
- 0760US8937256B2Method for manufacturing wiring board for mounting electronic component, wiring board for mounting electronic component, and method for manufacturing wiring board having an electronic componentINOUE MASAHIRO·Filed 2012·Granted Jan 20, 2015·1 cites·4 claims
- 0859US9132494B2Wiring board and method for manufacturing the sameINOUE MASAHIRO·Filed 2012·Granted Sep 15, 2015·1 cites·1 claims
- 0952US7202156B2Process for manufacturing a wiring substrateNGK SPARK PLUG CO·Filed 2004·Granted Apr 10, 2007·4 cites·6 claims
- 1051US2014202740A1Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring SubstrateNGK SPARK PLUG CO·Filed 2014·Application pending·0 cites
- 1147US2013161079A1Multi-layer wiring substrate and manufacturing method thereofNGK SPARK PLUG CO·Filed 2012·Application pending·0 cites
- 1246US2013111746A1Method of manufacturing multilayer wiring substrateNGK SPARK PLUG CO·Filed 2012·Application pending·0 cites
- 1343US9237656B2Method of manufacturing multi-layer wiring boardNGK SPARK PLUG CO·Filed 2012·Granted Jan 12, 2016·0 cites·3 claims
- 1443US2011155438A1Multilayer Wiring SubstrateNGK SPARK PLUG CO·Filed 2010·Application pending·0 cites
- 1541US8866025B2Multilayer wiring boardINOUE MASAHIRO·Filed 2012·Granted Oct 21, 2014·0 cites·4 claims
- 1641US2013180772A1Wiring board and method of manufacturing the sameNGK SPARK PLUG CO·Filed 2012·Application pending·0 cites
- 1741US2013098670A1Wiring substrate and manufacturing method of the sameNGK SPARK PLUG CO·Filed 2012·Application pending·0 cites
- 1840US2005102831A1Process for manufacturing a wiring substrateFiled 2004·Application pending·0 cites
- 1940US2005102830A1Process for manufacturing a wiring substrateFiled 2004·Application pending·0 cites
- 2039US9119333B2Multilayer wiring boardHANDO TAKUYA·Filed 2012·Granted Aug 25, 2015·0 cites·3 claims
- 2139US2012111616A1Electronic-component-mounted wiring substrate and method of manufacturing the sameINOUE MASAHIRO·Filed 2011·Application pending·0 cites
- 2232US2015366058A1Wiring substrate and method for producing the sameNGK SPARK PLUG CO·Filed 2015·Application pending·0 cites
- 2332US2015364410A1Circuit board, manufacturing method therefor, and pillar-shaped terminal for circuit boardNGK SPARK PLUG CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →