Inventor

CHANG JEN-YUAN

TW115 patents

⚠️ This page may combine multiple inventors who share the name “CHANG JEN-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG JEN-YUAN

TAIWAN SEMICONDUCTOR MFG CO LTD

Fan-out packages providing enhanced mechanical strength and methods for forming the same

Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same

Semiconductor die including guard ring structure and three-dimensional device structure including the same

Vertically mounted die groups

Vertically mounted die groups

Vertical semiconductor package including horizontally stacked dies and methods of forming the same

Dummy pattern structure for reducing dishing

Semiconductor die including guard ring structure and three-dimensional device structure including the same

Die stack and integrated device structure including improved bonding structure and methods of forming the same

Semiconductor package including test pad and bonding pad structure for die connection and methods for forming the same

Semiconductor package with high density of through-silicon vias (TSV)

Semiconductor package including package seal ring and methods for forming the same

Multi-chip package having stress relief structure

Guard ring and manufacturing method thereof

Pick-and-place system with a stabilizer

Semiconductor structure and method for forming the same

Deep trench capacitor fuse structure for high voltage breakdown defense and methods for forming the same

Semiconductor die including fuse structure and methods for forming the same

Package structure and method of manufacturing the same

Semiconductor structure and method for forming thereof

Package structure and method of forming thereof

Package structure and method of forming thereof

Dummy pattern structure for reducing dishing

High density through silicon conductive structures

Semiconductor structure having deep trench capacitor and method of manufacturing thereof

Semiconductor device with through substrate conductive pillars having different cross-sectional areas and method of making

Semiconductor package device and method for manufacturing the same

Semiconductor package including semiconductor dies having different lattice directions and method of forming the same

Semiconductor package including semiconductor dies having different lattice directions and method of forming the same

Semiconductor package including SoIC die stacks

Semiconductor structure with capping member containing oxynitride layer and method of manufacturing thereof

Pick-and-place system with a stabilizer

Semiconductor die assembly having a polygonal linking die

Fan-out packages providing enhanced mechanical strength and methods for forming the same

Semiconductor device and method of forming

Semiconductor structure and method of manufacturing the same

Semiconductor structure and method for forming the same

Deep trench capacitor fuse structure for high voltage breakdown defense and methods for forming the same

Method for forming a semiconductor die and a photoelectric device integrated in a same package

Multi-chip package having stress relief structure

Stacked semiconductor device test circuits and methods of use

Integrated semiconductor packaging system with enhanced dielectric-to-dielectric bonding quality

Die-group package having a deep trench device

Semiconductor device including power management die in a stack and methods of forming the same

HITACHI GLOBAL STORAGE TECH

Repeatable runout (RRO) compensation methods and apparatus for data storage devices

Method and apparatus for determining modulated, amplitude ramping RRO harmonics in multi-screw clamped HDD disk/spind assembly

Method and system for optimized servo track writing motor current profile to reduce written-in high-frequency repeatable runout track mis-registration

UNIV NAT TSING HUA

Absolute position detecting device and method

CHANG JEN-YUAN

Apparatus for positioning components in HDD

HITACHI GLOBAL STORAGE TECH NL

Integrated lead suspension for vibration damping in magnetic storage device