Inventor
MIERSCH EKKEHARD F
US9 patents
Patents
9 patentsUS5185073AFeb 9, 1993
Method of fabricating nendritic materials
IBM173 citations98
US5137461AAug 11, 1992
Separable electrical connection technology
IBM134 citations97
US5232548AAug 3, 1993
Discrete fabrication of multi-layer thin film, wiring structures
IBM83 citations94
US5028983AJul 2, 1991
Multilevel integrated circuit packaging structures
IBM78 citations93
US4445202AApr 24, 1984
Electrically switchable permanent storage
IBM111 citations93
US5173392ADec 22, 1992
Forming a pattern on a substrate
IBM27 citations92
US5122439AJun 16, 1992
Forming a pattern on a substrate
IBM30 citations92
US4295183AOct 13, 1981
Thin film metal package for LSI chips
IBM37 citations92
US4937930AJul 3, 1990
Method for forming a defect-free surface on a porous ceramic substrate
IBM9 citations73