Inventor · disambiguated record
Hiroyuki Tenmei
Also filed as: TENMEI HIROYUKI
20 granted patents·5 pending applications·587 citations·filing 2000–2014
96Inventor score
Top patents by PatentIndex Score
25 records- 0196US6780748B2Method of fabricating a wafer level chip size package utilizing a maskless exposureHITACHI LTD·Filed 2002·Granted Aug 24, 2004·150 cites·20 claims
- 0293US6791178B2Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devicesHITACHI LTD·Filed 2001·Granted Sep 14, 2004·77 cites·19 claims
- 0392US6610934B2Semiconductor module and method of making the deviceHITACHI LTD·Filed 2001·Granted Aug 26, 2003·67 cites·14 claims
- 0490US6515372B1Wiring board and its production method, semiconductor device and its production method, and electronic apparatusHITACHI LTD·Filed 2000·Granted Feb 4, 2003·44 cites·17 claims
- 0588US8704352B2Semiconductor device having a liquid cooling moduleHISANO NAE·Filed 2010·Granted Apr 22, 2014·11 cites·18 claims
- 0686US6770547B1Method for producing a semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 3, 2004·40 cites·28 claims
- 0786US6624504B1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 23, 2003·43 cites·24 claims
- 0883US6930388B2Semiconductor device and method for manufacturing the same and semiconductor device-mounted structureRENESAS TECH CORP·Filed 2001·Granted Aug 16, 2005·37 cites·24 claims
- 0983US6822317B1Semiconductor apparatus including insulating layer having a protrusive portionRENESAS TECH CORP·Filed 2000·Granted Nov 23, 2004·37 cites·16 claims
- 1081US7057283B2Semiconductor device and method for producing the sameHITACHI LTD·Filed 2004·Granted Jun 6, 2006·26 cites·30 claims
- 1173US7754581B2Method for manufacturing a three-dimensional semiconductor device and a wafer used thereinELPIDA MEMORY INC·Filed 2007·Granted Jul 13, 2010·5 cites·6 claims
- 1268US8937390B2Semiconductor device having a liquid cooling moduleHISANO NAE·Filed 2014·Granted Jan 20, 2015·2 cites·2 claims
- 1368US6946723B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2001·Granted Sep 20, 2005·13 cites·13 claims
- 1464US7002250B2Semiconductor moduleRENESAS TECH CORP·Filed 2001·Granted Feb 21, 2006·14 cites·28 claims
- 1564US6756688B2Wiring board and its production method, semiconductor device and its production method, and electronic apparatusHITACHI LTD·Filed 2002·Granted Jun 29, 2004·8 cites·26 claims
- 1659US7084498B2Semiconductor device having projected electrodes and structure for mounting the sameRENESAS TECH CORP·Filed 2002·Granted Aug 1, 2006·9 cites·36 claims
- 1758US7618847B2Bonding method of semiconductor and laminated structure fabricated therebyELPIDA MEMORY INC·Filed 2008·Granted Nov 17, 2009·1 cites·10 claims
- 1852US6998713B2Wiring board and method for producing sameRENESAS TECH CORP·Filed 2004·Granted Feb 14, 2006·3 cites·10 claims
- 1950US8334465B2Wafer of circuit board and joining structure of wafer or circuit boardISHINO MASAKAZU·Filed 2008·Granted Dec 18, 2012·0 cites·24 claims
- 2050US2006091553A1Wiring board and method for producing sameHITACHI LTD·Filed 2005·Application pending·0 cites
- 2149US2013140067A1Wafer or circuit board and joining structure of wafer or circuit boardELPIDA MEMORY INC·Filed 2012·Application pending·0 cites
- 2246US7378333B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2005·Granted May 27, 2008·0 cites·19 claims
- 2346US2009134498A1Semiconductor apparatusELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 2445US2008136024A1Semiconductor deviceELPIDA MEMORY INC·Filed 2007·Application pending·0 cites
- 2538US2016148865A1Electronic Circuit Board, Semiconductor Device Using the Same and Manufacturing Method for the SameHITACHI LTD·Filed 2013·Application pending·0 cites
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