Inventor

KAO CHIN-FU

TW71 patents

⚠️ This page may combine multiple inventors who share the name “KAO CHIN-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KAO CHIN-FU

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated circuit package and method

Adhesive and thermal interface material on a plurality of dies covered by a lid

Semiconductor packages and forming method thereof

Adhesive and thermal interface material on a plurality of dies covered by a lid

Package structure and method of fabricating the same

Package-on-package structure and manufacturing method thereof

Method for forming package structure

Semiconductor package and method of manufacturing semiconductor package

Package structure and method of fabricating the same

Semiconductor device and method of forming the same

Optical signal processing package structure

Package structure and method of fabricating the same

Semiconductor packages and method of manufacturing the same

Package structure and method for forming the same

Package structure having adhesive layer surrounded dam structure

Semiconductor package, integrated optical communication system and manufacturing method of integrated optical communication system

Semiconductor device and method of forming the same

Method of forming a dummy die of an integrated circuit having an embedded annular structure

Package structures

Method of fabricating package structure

Semiconductor device package having metal thermal interface material

Package structures

Package structure and method of fabricating the same

Method of fabricating package structure

Semiconductor device package having metal thermal interface material and method for forming the same

Package structure and method of fabricating the same

Package structure and manufacturing method thereof

Package-on-package structure and manufacturing method thereof

Optical transceiver and manufacturing method thereof

Package bonding structures and method of formation

Adhesive and thermal interface material on a plurality of dies covered by a lid

Integrated circuit package and method of forming same

Semiconductor packages

Method of forming package structure and package structure therefrom

Integrated circuit package and method of forming same

Semiconductor device package and methods of manufacture

Integrated circuit package and method

Semiconductor device and method of forming the same

Adhesive and thermal interface material on a plurality of dies covered by a lid

Method of forming package structure

Method for forming package structure

Package structure and semiconductor pacakge

Integrated circuit package and method

Integrated circuit package and method

Package structure, semiconductor package and method of fabricating the same

Package contact structure, semiconductor package and manufacturing method thereof

Package-on-package structure and method of manufacturing package

HUNG JUI-PIN

Packaging methods and structures using a die attach film

YU CHEN-HUA

Connector design for packaging integrated circuits

TAIWAN SEMICONDUCTOR MFG

Connector design for packaging integrated circuits