Integrated circuit package and method

Abstract

In an embodiment, a package includes: an interposer having a first side; a first integrated circuit device attached to the first side of the interposer; a second integrated circuit device attached to the first side of the interposer; an underfill disposed beneath the first integrated circuit device and the second integrated circuit device; and an encapsulant disposed around the first integrated circuit device and the second integrated circuit device, a first portion of the encapsulant extending through the underfill, the first portion of the encapsulant physically disposed between the first integrated circuit device and the second integrated circuit device, the first portion of the encapsulant being planar with edges of the underfill and edges of the first and second integrated circuit devices.

What is claimed is: 
     
       1. A package comprising:
 metal interconnects disposed over a substrate; 
 a first integrated circuit device attached to the metal interconnects, the first integrated circuit device having a first edge and a second edge opposite the first edge; 
 an underfill having a first portion disposed beneath the first integrated circuit device and having a first fillet extending along the first edge of the first integrated circuit device, an edge of the first portion of the underfill being planar with the second edge of the first integrated circuit device; and 
 an encapsulant around the first integrated circuit device and the underfill, the encapsulant having a first surface planar with the edge of the first portion of the underfill and the second edge of the first integrated circuit device. 
 
     
     
       2. The package of  claim 1 , wherein the first fillet extends at least partially up the first edge of the first integrated circuit device. 
     
     
       3. The package of  claim 1  further comprising:
 a redistribution structure disposed under the substrate. 
 
     
     
       4. The package of  claim 3  further comprising:
 a package substrate connected to the redistribution structure. 
 
     
     
       5. The package of  claim 1 , wherein the first fillet is disposed at an edge region of the substrate. 
     
     
       6. The package of  claim 1  further comprising:
 conductive connectors attaching the first integrated circuit device to the metal interconnects, the underfill surrounding the conductive connectors. 
 
     
     
       7. The package of  claim 1  further comprising:
 a second integrated circuit device attached to the metal interconnects, the second integrated circuit device having a first edge and a second edge opposite the first edge, 
 wherein the underfill has a second portion disposed beneath the second integrated circuit device and has a second fillet extending along the first edge of the second integrated circuit device, and 
 wherein the encapsulant has a second surface planar with the edge of the second portion of the underfill and the second edge of the second integrated circuit device. 
 
     
     
       8. The package of  claim 7 , wherein the second edge of the second integrated circuit device faces the second edge of the first integrated circuit device. 
     
     
       9. A package comprising:
 a package substrate; 
 an interposer bonded to the package substrate by a solder joint between a first conductive bump of the interposer and a bond pad of the package substrate; 
 an first integrated circuit device bonded to the interposer by a solder joint between a conductive bump of the first integrated circuit device and a second conductive bump of the interposer, the first integrated circuit device having a first edge and a second edge; 
 an underfill having a first portion and a first fillet, the first portion of the underfill disposed between the first integrated circuit device and the interposer, an edge of the first portion of the underfill disposed at the first edge of the first integrated circuit device, the edge of the first portion of the underfill being perpendicular to a top surface of the interposer, the first fillet extending along the second edge of the first integrated circuit device; and 
 an encapsulant disposed around the underfill and the first integrated circuit device. 
 
     
     
       10. The package of  claim 9 , wherein the edge of the first portion of the underfill is planar with the first edge of the first integrated circuit device. 
     
     
       11. The package of  claim 9 , wherein the edge of the first portion of the underfill extends beyond the first edge of the first integrated circuit device. 
     
     
       12. The package of  claim 9 , wherein the first edge of the first integrated circuit device extends beyond the edge of the first portion of the underfill. 
     
     
       13. The package of  claim 9 , wherein the interposer comprises a redistribution structure, the redistribution structure comprising a polymer layer, conductive lines, and the first conductive bump. 
     
     
       14. The package of  claim 9  further comprising:
 a second integrated circuit device attached to the interposer, the second integrated circuit device having a first edge and a second edge, 
 wherein the underfill has a second portion and a second fillet, the second portion of the underfill disposed between the second integrated circuit device and the interposer, an edge of the second portion of the underfill disposed at the first edge of the second integrated circuit device, the second fillet disposed at the second edge of the second integrated circuit device, the encapsulant disposed between the first portion of the underfill and the second portion of the underfill. 
 
     
     
       15. The package of  claim 14 , wherein the first edge of the second integrated circuit device faces the first edge of the first integrated circuit device. 
     
     
       16. The package of  claim 14 , wherein the second edge of the second integrated circuit device and the second edge of the first integrated circuit device face the edge regions of the interposer. 
     
     
       17. A device comprising:
 a package substrate; 
 an interposer attached to the package substrate; 
 a plurality of integrated circuit devices attached to the interposer, the integrated circuit devices having an asymmetrical layout in a top view; 
 an underfill between the integrated circuit devices and the interposer, the underfill having first fillets, the first fillets extending along sides of the integrated circuit devices that are disposed along the edge regions of the interposer, the underfill having no fillets extending along sides of the integrated circuit devices that face one another; and 
 an encapsulant around the underfill and the integrated circuit devices, the encapsulant extending along the sides of the integrated circuit devices that face one another. 
 
     
     
       18. The device of  claim 17  further comprising:
 conductive connectors attaching the integrated circuit devices to the interposer, the underfill surrounding the conductive connectors. 
 
     
     
       19. The device of  claim 17 , wherein the interposer comprises:
 a semiconductor substrate having a first surface and a second surface opposite the first surface; 
 through vias extending from the first surface of the semiconductor substrate to the second surface of the semiconductor substrate; and 
 an interconnect structure on the first surface of the semiconductor substrate, the interconnect structure connected to the through vias, the interconnect structure interconnecting the integrated circuit devices. 
 
     
     
       20. The device of  claim 17 , wherein the interposer interconnects the integrated circuit devices, and the integrated circuit devices comprise devices with different functions.