Inventor · disambiguated record

Chih-Chien Pan

Also filed as: PAN CHIH-CHIEN

26 granted patents·22 pending applications·76 citations·filing 2010–2025

94Inventor score

Technology areasH10W H10P H10H

Files withTAIWAN SEMICONDUCTOR MFG CO LTD39 NAKAMURA SHUJI3 UNIV CALIFORNIA3 CHUNG ROY B1 UNIVESITY OF CALIFORNIA1

Top patents by PatentIndex Score

48 records

0198US11239136B1Adhesive and thermal interface material on a plurality of dies covered by a lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·7 cites·20 claims
0298US10504824B1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·44 cites·20 claims
0397US11626344B2Adhesive and thermal interface material on a plurality of dies covered by a lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 11, 2023·4 cites·20 claims
0497US11456287B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·5 cites·20 claims
0593US12170236B2Method for forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·1 cites·20 claims
0692US11804468B2Manufacturing method of semiconductor package using jigTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 31, 2023·2 cites·20 claims
0791US11424174B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·2 cites·20 claims
0889US11302683B2Optical signal processing package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·2 cites·20 claims
0985US12300574B2Adhesive and thermal interface material on a plurality of dies covered by a lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
1085US2025140768A1Method of forming package structure and package structure therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1183US12218117B2Method of forming package structure and package structure therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
1282US8686397B2Low droop light emitting diode structure on gallium nitride semipolar substratesNAKAMURA SHUJI·Filed 2012·Granted Apr 1, 2014·4 cites·26 claims
1381US12266633B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
1481US11942403B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·0 cites·20 claims
1581US10796976B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 6, 2020·2 cites·20 claims
1680US12211818B2Manufacturing method of semiconductor package using jigTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
1780US11894287B2Adhesive and thermal interface material on a plurality of dies covered by a lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 6, 2024·0 cites·20 claims
1879US2024387446A1Jig for manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1979US2025349658A1Adhesion of a package component to a heat sinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2078US11121051B2Semiconductor packages and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·2 cites·20 claims
2177US11855054B2Method of forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
2276US11901255B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
2376US2025201770A1Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2474US11495526B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 8, 2022·0 cites·20 claims
2574US2025246503A1Adhesion of a package component to a heat sinkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2673US11062968B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·1 cites·20 claims
2771US11742323B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
2871US11664286B2Method for forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 30, 2023·0 cites·20 claims
2967US11205612B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 21, 2021·0 cites·20 claims
3062US2025349797A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3160US2025183237A1Package structure including a backside metal film on a semiconductor die and a thermally conductive underfill layer on the backside metal film and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
3260US2025349629A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3357US2025054900A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
3457US2024371722A1Thermal interface material including a multi-layer structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
3557US2025105086A1Integrated Circuit Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
3656US2024282661A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
3755US10535627B2Printing module, printing method and system of forming a printed structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·20 claims
3854US2024071857A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
3953US10163848B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·0 cites·20 claims
4052US2014151634A1Low droop light emitting diode structure on gallium nitride semipolar substratesUNIV CALIFORNIA·Filed 2014·Application pending·0 cites
4151US2023290714A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
4248US2013299776A1High output power, high efficiency blue light-emitting diodesUNIVESITY OF CALIFORNIA·Filed 2013·Application pending·0 cites
4348US2013299777A1Light-emitting diodes with low temperature dependenceUNIV CALIFORNIA·Filed 2013·Application pending·0 cites
4444US2012126198A1Light emitting diode for droop improvementNAKAMURA SHUJI·Filed 2011·Application pending·0 cites
4540US2012313077A1High emission power and low efficiency droop semipolar blue light emitting diodesNAKAMURA SHUJI·Filed 2012·Application pending·0 cites
4638US2011103077A1Light emitting diode packaging method with high light extraction and heat dissipation using a transparent vertical stand structureUNIV CALIFORNIA·Filed 2010·Application pending·0 cites
4737US2012126283A1High power, high efficiency and low efficiency droop iii-nitride light-emitting diodes on semipolar substratesZHAO YUJI·Filed 2011·Application pending·0 cites
4835US2012138986A1Method for fabrication of (al,in,ga) nitride based vertical light emitting diodes with enhanced current spreading of n-type electrodeCHUNG ROY B·Filed 2011·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →