Inventor · disambiguated record
Szu-Wei Lu
Also filed as: LU SZU W · LU SZU WEI
298 granted patents·87 pending applications·2,567 citations·filing 1998–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD322TAIWAN SEMICONDUCTOR MFG32LIN JING-CHENG9IND TECH RES INST7LU SZU WEI4
Top patents by PatentIndex Score
385 records- 0199US11417580B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·9 cites·20 claims
- 0299US10510634B2Package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·58 cites·20 claims
- 0399US10153222B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·79 cites·20 claims
- 0499US7361990B2Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump padsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Apr 22, 2008·134 cites·15 claims
- 0598US11824040B2Package component, electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 21, 2023·5 cites·20 claims
- 0698US11728254B2Giga interposer integration through chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 15, 2023·11 cites·20 claims
- 0798US11682645B2Plurality of stacked pillar portions on a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·4 cites·20 claims
- 0898US11521905B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 6, 2022·5 cites·20 claims
- 0998US11482497B2Package structure including a first die and a second die and a bridge die and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 25, 2022·7 cites·20 claims
- 1098US11469197B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 11, 2022·4 cites·20 claims
- 1198US11239136B1Adhesive and thermal interface material on a plurality of dies covered by a lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·7 cites·20 claims
- 1298US10867965B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·23 cites·20 claims
- 1398US10529690B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 7, 2020·35 cites·20 claims
- 1498US10504824B1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·44 cites·20 claims
- 1598US9064879B2Packaging methods and structures using a die attach filmHUNG JUI-PIN·Filed 2011·Granted Jun 23, 2015·836 cites·20 claims
- 1698US8779599B2Packages including active dies and dummy dies and methods for forming the sameLIN JING-CHENG·Filed 2011·Granted Jul 15, 2014·48 cites·14 claims
- 1797US12033968B2Package structure including stacked pillar portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 9, 2024·2 cites·20 claims
- 1897US12033978B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 9, 2024·2 cites·20 claims
- 1997US12033949B2Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 9, 2024·3 cites·20 claims
- 2097US11996345B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·4 cites·20 claims
- 2197US11626344B2Adhesive and thermal interface material on a plurality of dies covered by a lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 11, 2023·4 cites·20 claims
- 2297US11462418B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 4, 2022·5 cites·20 claims
- 2397US11456245B2Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 2497US11456287B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·5 cites·20 claims
- 2597US11355454B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·7 cites·20 claims
- 2697US11296032B2Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 5, 2022·5 cites·20 claims
- 2797US10529637B1Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 7, 2020·17 cites·20 claims
- 2897US9831224B2Solution for reducing poor contact in info packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 28, 2017·17 cites·20 claims
- 2997US9570421B2Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 14, 2017·27 cites·20 claims
- 3097US9368458B2Die-on-interposer assembly with dam structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 14, 2016·25 cites·18 claims
- 3197US7427803B2Electromagnetic shielding using through-silicon viasTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Sep 23, 2008·84 cites·18 claims
- 3296US11990351B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·3 cites·20 claims
- 3396US10861799B1Dummy die placement without backside chippingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·12 cites·20 claims
- 3496US10157888B1Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·24 cites·20 claims
- 3596US9508664B1Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 29, 2016·11 cites·20 claims
- 3696US8518753B2Assembly method for three dimensional integrated circuitWU CHIH-WEI·Filed 2011·Granted Aug 27, 2013·28 cites·20 claims
- 3795US11929261B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 12, 2024·3 cites·20 claims
- 3895US11769739B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 26, 2023·2 cites·20 claims
- 3995US11296051B2Semiconductor packages and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 5, 2022·9 cites·20 claims
- 4095US11289424B2Package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·11 cites·20 claims
- 4195US11139260B2Plurality of stacked pillar portions on a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 5, 2021·8 cites·20 claims
- 4295US10916488B2Semiconductor package having thermal conductive pattern surrounding the semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 9, 2021·8 cites·20 claims
- 4395US9793187B23D packages and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 17, 2017·15 cites·20 claims
- 4495US9704825B2Chip packages and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 11, 2017·11 cites·20 claims
- 4595US9412662B2Structure and approach to prevent thin wafer crackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 9, 2016·22 cites·19 claims
- 4695US8580683B2Apparatus and methods for molding die on wafer interposersWANG CHUNG YU·Filed 2011·Granted Nov 12, 2013·20 cites·16 claims
- 4795US7265034B2Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw bladeTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 4, 2007·33 cites·20 claims
- 4894US12237238B2Package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 25, 2025·2 cites·20 claims
- 4994US12230605B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·1 cites·20 claims
- 5094US11562941B2Semiconductor packages having thermal conductive patterns surrounding the semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 24, 2023·2 cites·20 claims
Showing the top 50 of 385 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →