Inventor · disambiguated record

Chin-Fu Kao

Also filed as: KAO CHIN-FU

69 granted patents·15 pending applications·969 citations·filing 2008–2025

98Inventor score

Technology areasH10W H10P G01N G02B G11C

Files withTAIWAN SEMICONDUCTOR MFG CO LTD73 KAO CHIN-FU4 IND TECH RES INST2 TAIWAN SEMICONDUCTOR MFG2 HUNG JUI-PIN1

Top patents by PatentIndex Score

84 records

0198US11239136B1Adhesive and thermal interface material on a plurality of dies covered by a lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·7 cites·20 claims
0298US10504824B1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·44 cites·20 claims
0398US9064879B2Packaging methods and structures using a die attach filmHUNG JUI-PIN·Filed 2011·Granted Jun 23, 2015·836 cites·20 claims
0497US11626344B2Adhesive and thermal interface material on a plurality of dies covered by a lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 11, 2023·4 cites·20 claims
0597US11456287B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·5 cites·20 claims
0695US11296051B2Semiconductor packages and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 5, 2022·9 cites·20 claims
0795US8664760B2Connector design for packaging integrated circuitsYU CHEN-HUA·Filed 2012·Granted Mar 4, 2014·18 cites·11 claims
0894US12131974B2Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 29, 2024·2 cites·20 claims
0993US12170236B2Method for forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·1 cites·20 claims
1093US10522470B1Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·7 cites·20 claims
1191US11424174B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·2 cites·20 claims
1291US10438934B1Package-on-package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 8, 2019·6 cites·20 claims
1389US11302683B2Optical signal processing package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·2 cites·20 claims
1488US11101260B2Method of forming a dummy die of an integrated circuit having an embedded annular structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·4 cites·20 claims
1586US12451408B2Package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·20 claims
1685US12300574B2Adhesive and thermal interface material on a plurality of dies covered by a lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
1785US12294002B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 6, 2025·0 cites·20 claims
1885US2025140768A1Method of forming package structure and package structure therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1984US2025336884A1Package bonding structures and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2083US12218117B2Method of forming package structure and package structure therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
2182US12444706B2Package bonding structures and method of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
2282US2025347602A1Test structures to determine integrated circuit bonding energies and methods of making and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2381US12119237B2Semiconductor device package having metal thermal interface materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
2481US11942403B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·0 cites·20 claims
2581US10796976B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 6, 2020·2 cites·20 claims
2681US2025233119A1Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2780US12293951B2Semiconductor package structure having ring portion with recess for adhesiveTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 6, 2025·0 cites·20 claims
2880US12176261B2Method of fabricating package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
2980US11894287B2Adhesive and thermal interface material on a plurality of dies covered by a lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 6, 2024·0 cites·20 claims
3080US11239134B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·1 cites·20 claims
3179US10852476B2Semiconductor package, integrated optical communication system and manufacturing method of integrated optical communication systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 1, 2020·2 cites·20 claims
3279US2024371656A1Method for forming semiconductor device package having metal thermal interface materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3379US2024387469A1Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3478US12442742B2Test structures to determine integrated circuit bonding energies and methods of making and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
3578US11121051B2Semiconductor packages and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 14, 2021·2 cites·20 claims
3678US10867955B2Package structure having adhesive layer surrounded dam structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·2 cites·20 claims
3778US2025259904A1Semiconductor package structure having ring portion with recess for adhesiveTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3877US11855054B2Method of forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
3976US11901255B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
4076US2025309120A1Bridge die having different surface orientation than ic dies interconnected by the bridge dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4175US12230609B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
4275US12068218B2Package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 20, 2024·0 cites·20 claims
4375US2024379491A1Method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4474US12272663B2Metal-bump sidewall protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
4574US11495526B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 8, 2022·0 cites·20 claims
4673US12015023B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
4773US11756855B2Method of fabricating package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·20 claims
4873US11062968B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·1 cites·20 claims
4973US2025343065A1Method for forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
5072US12424558B2Bridge die having different surface orientation than IC dies interconnected by the bridge dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims

Showing the top 50 of 84 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →