Inventor

PAN CHIH-CHIEN

TW27 patents

⚠️ This page may combine multiple inventors who share the name “PAN CHIH-CHIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PAN CHIH-CHIEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated circuit package and method

Adhesive and thermal interface material on a plurality of dies covered by a lid

Adhesive and thermal interface material on a plurality of dies covered by a lid

Method for forming package structure

Manufacturing method of semiconductor package using jig

Package structure and method of fabricating the same

Semiconductor device and method of forming the same

Optical signal processing package structure

Semiconductor packages and method of manufacturing the same

Package structure and method for forming the same

Semiconductor device and method of forming the same

Adhesive and thermal interface material on a plurality of dies covered by a lid

Semiconductor structure and method of forming the same

Method of forming package structure and package structure therefrom

Manufacturing method of semiconductor package using jig

Integrated circuit package and method

Semiconductor device and method of forming the same

Adhesive and thermal interface material on a plurality of dies covered by a lid

Method of forming package structure

Semiconductor structure and method of forming the same

Method for forming package structure

Integrated circuit package and method

Integrated circuit package and method

Package structure and method of fabricating the same

Printing module, printing method and system of forming a printed structure

Semiconductor package

NAKAMURA SHUJI

Low droop light emitting diode structure on gallium nitride semipolar substrates