Inventor

HSU CHIA-KUEI

TW62 patents

Patents

50 patents

US11749644B2Sep 5, 2023

Semiconductor device with curved conductive lines and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations86

US11264359B2Mar 1, 2022

Chip bonded to a redistribution structure with curved conductive lines

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations86

US11164754B2Nov 2, 2021

Fan-out packages and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations86

US12300568B2May 13, 2025

High efficiency heat dissipation using discrete thermal interface material films

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations75

US12040267B2Jul 16, 2024

Organic interposer including intra-die structural reinforcement structures and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11908757B2Feb 20, 2024

Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11830800B2Nov 28, 2023

Metallization structure and package structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11798897B2Oct 24, 2023

Package structure and methods of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11699668B2Jul 11, 2023

Semiconductor device package having warpage control and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11610835B2Mar 21, 2023

Organic interposer including intra-die structural reinforcement structures and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11594477B2Feb 28, 2023

Semiconductor package and method of manufacturing semiconductor package

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11393746B2Jul 19, 2022

Reinforcing package using reinforcing patches

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73

US11282756B2Mar 22, 2022

Organic interposer including stress-resistant bonding structures and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73

US12322703B2Jun 3, 2025

Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12249568B2Mar 11, 2025

Metallization structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12237277B2Feb 25, 2025

Package structure and methods of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12154888B2Nov 26, 2024

Semiconductor package and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12132021B2Oct 29, 2024

Method for fabricating semiconductor package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12094810B2Sep 17, 2024

Reinforcing package using reinforcing patches

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12033928B2Jul 9, 2024

Manufacturing method of semiconductor package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12035475B2Jul 9, 2024

Semiconductor package with stress reduction design and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11973001B2Apr 30, 2024

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11862549B2Jan 2, 2024

Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11784148B2Oct 10, 2023

Semiconductor package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11728256B2Aug 15, 2023

Reinforcing package using reinforcing patches

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11682602B2Jun 20, 2023

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11652037B2May 16, 2023

Semiconductor package and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63

US11282803B2Mar 22, 2022

Device, semiconductor package and method of manufacturing semiconductor package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12444696B2Oct 14, 2025

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12431415B2Sep 30, 2025

Buffer block structures for C4 bonding and methods of using the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12424511B2Sep 23, 2025

High efficiency heat dissipation using discrete thermal interface material films

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12368114B2Jul 22, 2025

Semiconductor device package having warpage control and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12347758B2Jul 1, 2025

Dual-underfill encapsulation for packaging and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12347764B2Jul 1, 2025

Organic interposer including intra-die structural reinforcement structures and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12322666B2Jun 3, 2025

Package assembly lid and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12315768B2May 27, 2025

Package assembly including lid with additional stress mitigating feet and methods of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12170238B2Dec 17, 2024

Semiconductor die package with multi-lid structures and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12113033B2Oct 8, 2024

Chip package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12100664B2Sep 24, 2024

Semiconductor device with curved conductive lines and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12094828B2Sep 17, 2024

Eccentric via structures for stress reduction

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11855004B2Dec 26, 2023

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11756873B2Sep 12, 2023

Semiconductor package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11728284B2Aug 15, 2023

Chip package structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11705420B2Jul 18, 2023

Multi-bump connection to interconnect structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62

US11694941B2Jul 4, 2023

Semiconductor die package with multi-lid structures and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

Showing the top 50 of 62 patents by PatentIndex Score.