Inventor

YEW MING-CHIH

TW124 patents

⚠️ This page may combine multiple inventors who share the name “YEW MING-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YEW MING-CHIH

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor packaging structure and manufacturing method thereof

Semiconductor device with curved conductive lines and method of forming the same

Chip bonded to a redistribution structure with curved conductive lines

Fan-out packages and methods of forming the same

Semiconductor device and method of manufacture

Semiconductor device package with warpage control structure

Semiconductor packages having dummy connectors and methods of forming same

Semiconductor packages having dummy connectors and methods of forming same

Semiconductor device package with warpage control structure

Package-on-package structure with through molding via

Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate

Package on packaging structure and methods of making same

Method of forming encapsulated semiconductor device package

Semiconductor device and method of manufacture

Package structure

Semiconductor package and method of forming the same

Organic interposer including intra-die structural reinforcement structures and methods of forming the same

Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the same

Metallization structure and package structure

Semiconductor device package having warpage control and method of forming the same

Organic interposer including intra-die structural reinforcement structures and methods of forming the same

Method for forming chip package structure

Semiconductor package and method of manufacturing semiconductor package

Reinforcing package using reinforcing patches

Organic interposer including stress-resistant bonding structures and methods of forming the same

Structure and formation method of chip package with shielding structure

Method for forming chip package structure

Semiconductor packages having dummy connectors and methods of forming same

Semiconductor package assembly, semiconductor package and forming method thereof

3D packages and methods for forming the same

Semiconductor package and method for manufacturing the same

Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the same

Semiconductor packages with thermal lid and methods of forming the same

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacture

Semiconductor package including stress buffers and methods of forming the same

Integrated fan-out package having stress release structure

GEN MOTORS CORP

Vehicle wheel suspension

Elastic beam-torsion rod connection

Vehicle wheel suspension

Automatic vehicle level control

Jet ignition engine with valve-carried ignition chamber

TAIWAN SEMICONDUCTOR MFG

Semiconductor device package and method

Package-on-package structure with through molding via

Semiconductor device package and method

YEW MING-CHIH

Electrical connection for chip scale packaging

Packaging structures and methods for semiconductor devices

Electrical connection for chip scale packaging

LIN WEN YI

Ring structure for chip packaging

ADVANCED CHIP ENG TECH INC

3D electronic packaging structure having a conductive support substrate