Inventor

LIN PO-YAO

TW221 patents

⚠️ This page may combine multiple inventors who share the name “LIN PO-YAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN PO-YAO

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor packaging structure and manufacturing method thereof

Semiconductor device with curved conductive lines and method of forming the same

Semiconductor package with dual sides of metal routing

Chip bonded to a redistribution structure with curved conductive lines

Fan-out packages and methods of forming the same

Semiconductor package with redistribution structure and pre-made substrate on opposing sides for dual-side metal routing

Semiconductor device package with warpage control structure

Integrated fan-out package on package structure and methods of forming same

Chip package with thermal dissipation structure and method for forming the same

Semiconductor device package with warpage control structure

Package-on-package structure with through molding via

Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate

Package on packaging structure and methods of making same

Method of forming encapsulated semiconductor device package

High efficiency heat dissipation using discrete thermal interface material films

Package structure

Semiconductor package and method of forming the same

Organic interposer including intra-die structural reinforcement structures and methods of forming the same

Semiconductor package structure and method for forming the same

Multi-chip device and method of formation

Method for forming package structure with lid

Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof

Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the same

Semiconductor package and method of forming the same

Metallization structure and package structure

Frames stacked on substrate encircling devices and manufacturing method thereof

Package structure and methods of manufacturing the same

Chip package structure and method for forming the same

Structure and formation method of package with underfill

Semiconductor device package having warpage control and method of forming the same

Multi-chip device and method of formation

Organic interposer including intra-die structural reinforcement structures and methods of forming the same

Method for forming chip package structure

Semiconductor package and method of manufacturing semiconductor package

Semiconductor package

Semiconductor package

Reinforcing package using reinforcing patches

Organic interposer including stress-resistant bonding structures and methods of forming the same

Package structure with lid and method for forming the same

Multi fan-out package structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG

Semiconductor device package and method

Package-on-package structure with through molding via

Semiconductor device package and method

YEW MING-CHIH

Electrical connection for chip scale packaging

Packaging structures and methods for semiconductor devices

ASUSTEK COMP INC

Side exhaust heat dissipation module

Heat dissipation module

IND TECH RES INST

Integrated circuit package with multiple heat dissipation paths

LIN WEN-YI

Board-level package with tuned mass damping structure

LIN PO-YAO

Thermally enhanced heat spreader for flip chip packaging