Inventor · disambiguated record
Kevin Engel
Also filed as: ENGEL KEVIN
6 granted patents·150 citations·filing 2001–2018
81Inventor score
Top patents by PatentIndex Score
6 records- 0193US6762122B2Methods of forming metallurgy structures for wire and solder bondingUNITIVIE INTERNAT LTD·Filed 2001·Granted Jul 13, 2004·131 cites·42 claims
- 0283US9920433B2Additive metal deposition processINCODEMA3D LLC·Filed 2015·Granted Mar 20, 2018·3 cites·31 claims
- 0380US7871899B2Methods of forming back side layers for thinned wafersAMKOR TECHNOLOGY INC·Filed 2007·Granted Jan 18, 2011·10 cites·34 claims
- 0459US10941495B2Additive metal deposition processINCODEMA3D LLC·Filed 2018·Granted Mar 9, 2021·0 cites·19 claims
- 0554US7665652B2Electronic devices including metallurgy structures for wire and solder bondingUNITIVE INT LTD·Filed 2004·Granted Feb 23, 2010·6 cites·38 claims
- 0644US8643177B2Wafers including patterned back side layers thereonRINNE GLENN A·Filed 2010·Granted Feb 4, 2014·0 cites·20 claims
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