Inventor

MANGRUM MARC ALAN

US22 patents

⚠️ This page may combine multiple inventors who share the name “MANGRUM MARC ALAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MANGRUM MARC ALAN

AMKOR TECHNOLOGY INC

Packaged electronic device having integrated antenna and locking structure

Flip chip self-alignment features for substrate and leadframe applications

Packaged electronic device having integrated antenna and locking structure

Packaged electronic device having integrated antenna and locking structure

Semiconductor package having inspection structure and related methods

Embedded vibration management system

Method of forming a semiconductor package with conductive interconnect frame and structure

Semiconductor package having inspection structure and related methods

Semiconductor package with clip alignment notch

Embedded vibration management system having an array of vibration absorbing structures

AMKOR TECH SINGAPORE HOLDING PTE LTD

Flip chip curved sidewall self-alignment features for substrate and method for manufacturing the self-alignment features

Flip chip self-alignment features for substrate and leadframe applications

Flip chip self-alignment features for substrate and leadframe applications and method of manufacturing the flip chip self-alignment features

Packaged electronic device having integrated antenna and locking structure

Packaged electronic device having integrated antenna and locking structure

FREESCALE SEMICONDUCTOR INC

Circuit device with at least partial packaging, exposed active surface and a voltage reference plane

Circuit device with at least partial packaging and method for forming

Circuit device with at least partial packaging and method for forming

MANGRUM MARC ALAN

Shielding technique for semiconductor package including metal lid

IC package with integrated electrostatic discharge protection

Shielding technique for semiconductor package including metal lid and metalized contact area

LEAL GEORGE R

Circuit device with at least partial packaging and method for forming