Inventor · disambiguated record
Katsuro Aoshima
Also filed as: AOSHIMA KATSURO
3 granted patents·144 citations·filing 1996–2000
78Inventor score
Files withMEIKO ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0188US6239983B1Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit boardMEIKO ELECTRONICS CO LTD·Filed 1998·Granted May 29, 2001·58 cites·6 claims
- 0285US5886877ACircuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit boardMEIKO ELECTRONICS CO LTD·Filed 1996·Granted Mar 23, 1999·54 cites·12 claims
- 0384US6350957B1Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit boardMEIKO ELECTRONICS CO LTD·Filed 2000·Granted Feb 26, 2002·32 cites·8 claims
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