Inventor · disambiguated record
Yu-Hui Wu
Also filed as: WU YU-HUI
5 granted patents·4 pending applications·1 citations·filing 2011–2020
60Inventor score
Files withAT&S CHONGQING COMPANY LTD4KINSUS INTERCONNECT TECH CORP2BETZLER BOAS1LIN TING-HAO1UNIV YUAN ZE1
Top patents by PatentIndex Score
9 records- 0173US11943874B2Stacking arrays and separator bodies during processing of component carriers on array levelAT&S CHONGQING COMPANY LTD·Filed 2020·Granted Mar 26, 2024·1 cites·18 claims
- 0245US11553599B2Component carrier comprising pillars on a coreless substrateAT&S CHONGQING COMPANY LTD·Filed 2019·Granted Jan 10, 2023·0 cites·18 claims
- 0344US2015027756A1Circuit board structure for high frequency signalsKINSUS INTERCONNECT TECH CORP·Filed 2013·Application pending·0 cites
- 0443US2020163223A1Method of Manufacturing a Component Carrier Using a Separation Component, the Component Carrier, and a Semifinished ProductAT&S CHONGQING COMPANY LTD·Filed 2019·Application pending·0 cites
- 0539US9079272B2Solder joint with a multilayer intermetallic compound structureUNIV YUAN ZE·Filed 2013·Granted Jul 14, 2015·0 cites·10 claims
- 0639US8823699B2Getting snapshots in immersible 3D scene recording in virtual worldBETZLER BOAS·Filed 2011·Granted Sep 2, 2014·0 cites·20 claims
- 0739US2015041183A1Chip board package structureKINSUS INTERCONNECT TECH CORP·Filed 2013·Application pending·0 cites
- 0835US11160169B2Component carrier with component embedded in cavity and with double dielectric layer on front sideAT&S CHONGQING COMPANY LTD·Filed 2019·Granted Oct 26, 2021·0 cites·17 claims
- 0935US2013233602A1Surface treatment structure of circuit patternLIN TING-HAO·Filed 2012·Application pending·0 cites
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