Inventor
TSUMURA KIYOAKI
JP15 patents
⚠️ This page may combine multiple inventors who share the name “TSUMURA KIYOAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
14 patentsUS5565378AOct 15, 1996
Process of passivating a semiconductor device bonding pad by immersion in O2 or O3 solution
MITSUBISHI ELECTRIC CORP66 citations96
US4821944AApr 18, 1989
Method for bonding a wire and bonding apparatus
MITSUBISHI ELECTRIC CORP60 citations95
US6288376B1Sep 11, 2001
Method and apparatus for melting a bump by induction heating
MITSUBISHI ELECTRIC CORP46 citations92
US5334803AAug 2, 1994
Semiconductor device and method of producing the same
MITSUBISHI ELECTRIC CORP40 citations92
US5293066AMar 8, 1994
Semiconductor device mounting structure including lead frame and lead plate
MITSUBISHI ELECTRIC CORP43 citations92
US5229646AJul 20, 1993
Semiconductor device with a copper wires ball bonded to aluminum electrodes
MITSUBISHI ELECTRIC CORP41 citations92
US5116783AMay 26, 1992
Method of producing semiconductor device
MITSUBISHI ELECTRIC CORP22 citations92
US5023697AJun 11, 1991
Semiconductor device with copper wire ball bonding
MITSUBISHI ELECTRIC CORP22 citations92
US5003373AMar 26, 1991
Structure of electrode junction for semiconductor device
MITSUBISHI ELECTRIC CORP22 citations92
US4886200ADec 12, 1989
Capillary tip for bonding a wire
MITSUBISHI ELECTRIC CORP34 citations92
US4984056AJan 8, 1991
Semiconductor integrated circuit device
MITSUBISHI ELECTRIC CORP21 citations82
US5124277AJun 23, 1992
Method of ball bonding to non-wire bonded electrodes of semiconductor devices
MITSUBISHI ELECTRIC CORP17 citations73
US5093712AMar 3, 1992
Resin-sealed semiconductor device
MITSUBISHI ELECTRIC CORP16 citations71
USRE35496EApr 29, 1997
Semiconductor device and method of producing the same
MITSUBISHI ELECTRIC CORP3 citations62