Inventor · disambiguated record
Winston Shue
Also filed as: SHUE WINSTON
7 granted patents·1 pending application·131 citations·filing 2002–2005
86Inventor score
Files withTAIWAN SEMICONDUCTOR MFG8
Top patents by PatentIndex Score
8 records- 0188US6706629B1Barrier-free copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Mar 16, 2004·54 cites·47 claims
- 0285US6943111B2Barrier free copper interconnect by multi-layer copper seedTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 13, 2005·36 cites·32 claims
- 0364US6649513B1Copper back-end-of-line by electropolishTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 18, 2003·9 cites·30 claims
- 0464US6627527B1Method to reduce metal silicide void formationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 30, 2003·15 cites·33 claims
- 0562US6793797B2Method for integrating an electrodeposition and electro-mechanical polishing processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 21, 2004·8 cites·18 claims
- 0657US6555474B1Method of forming a protective layer included in metal filled semiconductor featuresTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 29, 2003·7 cites·20 claims
- 0749US6995089B2Method to remove copper without pattern density effectTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 7, 2006·2 cites·40 claims
- 0845US2005263902A1Barrier free copper interconnect by multi-layer copper seedTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
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